For GaN-based light emitting diodes (LEDs), the growth mechanism and interface roughness of the ncontact, active region, and p-contact layers are of vital importance for achieving superior optical and electrical characteristics of such devices. Nanoscale range surface morphology is one of the key parameters actively employed to developing high optical efficiency applications. In this study, we illustrate the use of atomic force microscopy to investigate and optimise the surface morphology of (a) sapphire substrates and (b) metalorganic chemical vapour deposition (MOCVD) grown InGaN/GaN LED constituent layers (i.e., n-GaN, InGaN active region, and p-GaN). Several optimal cases are presented and discussed, where based on the surface morphology findings an improved selection of (a) substrates and (b) MOCVD growth parameters was achieved leading to an overall enhancement (over 2 times) of the optical output efficiency of these devices. Applying the principles and observations reported, a thermally robust 465 nm multiple quantum well LED with an unpackaged chip-level power output in the 4.0-5.0 mW range and forward voltage < 3.2 V at 20 mA was consistently achieved.
In this study, we investigate the dependence of GaN surface morphology on the absolute strain values for thin (<10 µm) epitaxial films grown by MOCVD on c-plane sapphire substrates of various miscut angles towards the m-plane. Results indicate an excellent correlation between the surface roughness observed employing an AFM tool and epilayer strain values. An overall increase of surface roughness (decrease of atomic terrace width) is found with decreasing compressive strain (epilayer vs. bulk value). In addition, sapphire substrates with increasing miscut angle (0.30 deg) appear to relax the inherent, built-in strain differently in the vertical (growth) direction when compared to just (0.00 deg) substrates. Strain relaxation by typical V-shaped, hexagonal pits is directly imaged through the comparison of surface features inside and outside of pits in the thin GaN epilayer films.
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