Given the need for stretchable sensors, many studies have been conducted on eutectic gallium-indium, which has superior properties as a conductive ink. However, it has remained a challenge to manufacture sensors in a consistent and reproducible manner because conventional mold-based fabrication still depends highly on manual techniques. To overcome this limitation, the direct ink writing was used in this study, focusing on improving the stability of writing by exploring issues related to failure and ensuring the consistency of the microchannel by selecting appropriate process variables, including the syringe material. As a result, multiple sensors produced under the same manufacturing conditions had similar behaviors. This fabrication technique improved the accuracy of manufacturing a microchannel, and its behavior was predicted successfully by a simple mathematical model, which was confirmed by nondestructive inspections of the microchannel. In developing a one-piece glove-type sensor without an assembly process, the efficiency of the fabrication technique was also emphasized.

For wider applications of liquid metal-based stretchable electronics, electrical interface has remained a crucial issue due to its fragile electromechanical stability and complex fabrication steps. In this study, a direct writing-based technique is introduced to form the writing paths of conductive liquid metal (eutectic gallium−indium, eGaIn) and electrical connections to off-the-shelf metal electrodes in a single process. Specifically, by extending eGaIn wires written on a silicone substrate, the eGaIn wires were physically connected to five different metal electrodes, of which stability as an electrical connection was investigated. Among the five different surface materials, the metal electrode finished by electroless nickel immersion gold (ENIG) was reproducible and had low contact resistance without time-dependent variation. In our experiments, it was verified that the electrode part made by an ENIG-finished flexible flat cable (FFC) was mechanically (strain, ≤100%; pressure, ≤600 kPa) and thermally (temperature, ≤180 °C) durable. By modifying the trajectories of eGaIn wires, soft sensor systems composed of 10 sensing units were fabricated and tested to measure finger joint angles and ground reaction forces, respectively. The proposed method enables eGaIn-based soft sensors or circuits to be connected to typical electronic components through FFCs or weldable surfaces, using only off-the-shelf materials without additional mechanical or chemical treatments.

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