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Purpose -This paper aims to describe and document the application of commonly utilized solder joint failure analysis techniques to lead-free solder joints. Design/methodology/approach -Traditional failure analysis techniques, including visual inspection, X-ray radiography, mechanical strength testing, dye and pry, metallography, microscopy and photomicrography, are reviewed. These techniques are demonstrated as applied to lead-free and tin lead solder joints. Common failure modes observed in lead-free and tin lead solder joints are described and compared. Findings -It is shown that the traditional failure analysis techniques previously utilized for tin lead solder joints are widely applicable to the analysis of lead-free solder joints. The changes required to effectively apply these techniques to the analysis of lead-free solder joints are described. Originality/value -This paper will be instrumental to the process, quality, reliability and failure analysis engineering disciplines in furthering understanding of the application of failure analysis techniques of both tin lead and lead-free solder joints.

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The mechanical integrity of solder joint interconnects in PWB assemblies with micro ‐ BGA, chip scale, and LGA packages are being questioned as the size and pitch decrease. Three‐point cyclic bend testing provides a useful tool for characterizing the expected mechanical cycling fatigue reliability of PWB assemblies. Cyclic bend testing is useful for characterizing bending issues in electronic assemblies such as repetitive keypad actuation in cell phone products. This paper presents the results of three‐point bend testing of PWB assemblies with fine pitch packages. The methodology of materials analyses of the metallurgy of solder interconnects following mechanical bending and thermal cycle testing is described.