The roles of growth direction and Si content on the columnar/equiaxed transition and on dendritic spacings of Al–Cu–Si alloys still remain as an open field to be studied. In the present investigation, Al–6 wt-Cu–4 wt-Si and Al–6 wt-Cu alloys were directionally solidified upwards and horizontally under transient heat flow conditions. The experimental results include tip growth rate and cooling rates, optical microscopy, scanning electron microscopy energy dispersive spectrometry and dendrite arm spacings. It was found that silicon alloying contributes to significant refinement of primary/secondary dendritic spacings for the upward configuration as compared with corresponding results of the horizontal growth. Experimental growth laws are proposed, and the effects of the presence/absence of solutal convection in both growth directions are discussed.
The main purpose of this paper is to investigate both the columnar to equiaxed transition and primary dendritic arm spacings of Al-3wt.%Si alloy during the horizontal directional solidification. The transient heat transfer coefficient at the metal-mold interface is calculated based on comparisons between the experimental thermal profiles in castings and the simulations provided by a finite difference heat flow program. Simulated curve of the interfacial heat transfer coefficient was used in another numerical solidification model to determine theoretical values of tip growth rates, cooling rates and thermal gradients that are associated with both columnar to equiaxed transition and primary dendritic arm spacings. A good agreement was observed between the experimental values of these thermal variables and those numerically simulated for the alloy examined. A comparative analysis is carried out between the experimental data of this work and theoretical models from the literature that have been proposed to predict the primary dendritic spacings. In this context, this study may contribute to the understanding of how to manage solidification operational parameters aiming at designing the microstructure of Al-Si alloys.
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