This paper describes an effort to develop microfabricated planar antennas that utilize a plasma enhanced chemical vapor deposition (PECVD) based silicon carbide (SiC) thin film packaging technology to provide chemical resistance. The antennas are coplanar waveguide fed dual frequency folded slot antennas fabricated on alumina substrates that utilize a selfmatching impedance technique. The PEVCD SiC thin film was deposited at 300°C at a chamber pressure of 900 mTorr and a power level of 100 W. The SiC film thickness was 450 nm. The antennas exhibit a return loss better than -15 dB at 5 and 7 GHz before and after SiC deposition. The gain of the antennas is 3 dB at 5 and 7 GHz before and after SiC deposition. The SiC-coated antennas were submerged into Au etchant for over a 24 hr period with no degradation in RFperformance or physical integrity.

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This document describes the communication architecture for the Power, Avionics and Software (PAS) 1.0 subsystem for the Advanced Extravehicular Mobility Unit (AEMU). The following systems are described in detail: Caution Warning and Control System, Informatics, Storage, Video, Audio, Communication, and Monitoring Test and Validation.This document also provides some background as well as the purpose and goals of the PAS subsystem being developed at Glenn Research Center (GRC).