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Nanocomposites made up of polymer matrices and carbon nanotubes are a class of advanced materials with great application potential in electronics packaging. Nanocomposites with carbon nanotubes as fillers have been designed with the aim of exploiting the high thermal, electrical and mechanical properties characteristic of carbon nanotubes. Heat dissipation in electronic devices requires interface materials with high thermal conductivity. Here, current developments and challenges in the application of nanotubes as fillers in polymer matrices are explored. The blending together of nanotubes and polymers result in what are known as nanocomposites. Among the most pressing current issues related to nanocomposite fabrication are (i) dispersion of carbon nanotubes in the polymer host, (ii) carbon nanotube-polymer interaction and the nature of the interface, and (iii) alignment of carbon nanotubes in a polymer matrix. These issues are believed to be directly related to the electrical and thermal performance of nanocomposites. The recent progress in the fabrication of nanocomposites with carbon nanotubes as fillers and their potential application in electronics packaging as thermal interface materials is also reported.

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Recognizing the role of human factors engineering (HFE) in the development of medical devices and combination products that involve devices, the Food and Drug Administration (FDA) now requires human factors (HF) validations before market approval. Manufacturers are responsible for ensuring their products are safe and effective through the application of HFE. However, key stakeholders are still learning and developing capabilities to adapt to the regulatory component. Nonetheless, the lack of the corresponding HF capabilities hinders compliance with the FDA’s expectations, and though ultimate success. No known previous work has looked into FDA HF validation projects to assess the underlying factors and implications of failed submissions. Applying system dynamics (SD), a causal loop diagram (CLD) was developed. CLDs are useful for the exploration of the causal interactions among factors or variables, as well as the underlying feedback structure of a complex system. This work can serve to help manufacturers better understand the FDA’s HF requirement to enable overall product success. Further, with patient safety as a common goal, HF service providers (HFSPs) and regulators should be aware of the need to ensure the consistent quality of the HF element in premarket submissions.

Three dimensional (3D) integration offers numerous electrical advantages like shorter interconnection distances between different dies in the stack, reduced signal delay, reduced interconnect power and design flexibilities. The main enabler of 3D integration is through-silicon-vias (TSVs) and stacking of multiple dies. Irrespective of these advantages, thermal management in 3D stacks poses significant challenges for the implementation of 3D integrated circuits. Even though extensive research work has been done in understanding the thermal management in two dimensional (2D) planar circuits for the past several decades, 3D integration offers a new set of challenges in terms of thermal management, which makes it difficult to readily apply the thermal management strategies available for 2D planar circuits. Over the past decade, some work has been done in thermal analysis and management of 3D stacks but still, knowledge is scattered and a comprehensive understanding is lacking. This research work focuses on bringing together the limited work on thermal analysis and thermal management in 3D vertically integrated circuits available in the literature. A compilation and analysis of the results from investigations on thermal management in 3D stacks is presented in this review with special emphasis on experimental studies conducted on different thermal management strategies. Furthermore, 3D integration technologies, thermal management challenges, and advanced 2D thermal management solutions are discussed.