Development of systems for capture, sequestration, and tracking of nanoparticles (NPs) is becoming a significant focus in many aspects of nanotechnology and environmental research. These systems enable a broad range of applications for evaluating concentration, distribution, and effects of NPs for environmental, clinical, epidemiological, and occupational exposure studies. Herein, we describe the first example of a ligand-graft multifunctional platform for capture and detection of cerium oxide (CeO or ceria) NPs. The approach involves the use of redox-active ligands containing o-dihydroxy functionality, enabling multivalent binding, surface retention, and formation of charge transfer complexes between the grafted ligand and the NPs. Using this strategy, paper-based and microarray-printed platforms with NP-capture ability involving either catechol or ascorbic acid as ligands were successfully fabricated. Surface modification was determined by infrared spectroscopy, electron microscopy, X-ray spectroscopy, and thermogravimetric analysis. Functionality was demonstrated for the rapid assessment of NPs in chemical mechanical planarization (CMP) slurries and CMP wastewaters. This novel approach can enable further development of devices and separation technologies including platforms for retention and separation of NPs and measurement tools for detection of NPs in various environments.
The role of homologous linear aliphatic polyamines as additives in Cu CMP slurries was investigated. We show that, in addition to forming stable complexes with copper ions in solution, the polyamines also interact with the copper metal preventing its corrosion. The latter effect increases with the polyamine chain length making the superior members of the homologues series effective passivating agents. A mechanism that explains the trend in the anticorrosion activity of polyamines is proposed. © The Author(s) In-depth investigation of Cu-CMP has gained recently significant impetus in response to increasingly sophisticated applications. From the chemistry view point, the removal of copper is the result of two consecutive processes: the oxidation of the metal and the complexation of copper ions to facilitate their transport in the liquid phase. Hydrogen peroxide (H 2 O 2 ) is the oxidant most widely used to 'extract' electrons from copper. [1][2][3][4][5][6] The resulting ions easily hydrolyze at neutral and alkaline pH forming insoluble oxide films that hinder the oxidation. The role of complexing agents is to dissolve the oxides and ensure the access of H 2 O 2 molecules to the metal. In their presence, the oxidation can continue indefinitely but its rate is often uncontrollable. The corrosion inhibitors (passivating agents) added to the slurry allow the 'fine-tuning' of Cu dissolution. The copper passivation can be caused by an adherent insoluble film on the copper surface or the chemisorption of species capable of preventing the reaction with the oxidizer. The corrosion inhibition provided by benzotriazole (BTA) is an example of the first mechanism. It is widely accepted that its effectiveness is due to a strongly attached insoluble multi-molecular layer on the copper surface, the precise structure of which is still being debated. 1,[7][8][9][10][11][12] In the case of the chemisorption mechanism, the extent of the stability gained by copper depends on the strength of the metal-ligand interactions as well as on how the ligand molecule is attached to the surface (conformational factor). Starting from the hypothesis that in the case of linear aliphatic polyamines the latter aspect varies widely, we initiated a systematic investigation of their passivating action in the corrosion of copper. In doing so, we fill a gap in Cu-CMP research as the study of linear aliphatic polyamines was limited until now to the first member of the series (ethylenediamine, EDA) and only in its role as complexing agent. 13-17 ExperimentalThe aqueous polishing slurries were freshly prepared by dissolving ethylenediamine (EDA), diethylenetriamine (DETA), triethylenetetramine (TETA), tetraethylenepentamine (TEPA) and pentaethylenehexamine (PEHA) in deionized water followed by the addition (if needed) of H 2 O 2 . In all cases the pH was adjusted at 9.0 ± 0.1.Dynamic polishing experiments were carried out for 1 min on an Allied benchtop unit using an IC 1000 polyurathane pad under a down force of 58 LbF. The platen and carrier rotation sp...
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