Processes and procedures have been developed for applying the thin film tungsten electrical intraconnections to the MC2730 RTG "one-dimensional" thermopile after polishing, the surface to be metallized is cleaned with a detergent/organic solvent procedure and then etched with hydrofluoric acid to minimize the oxide. Tungsten contacts are sputtered onto the thermopile and the individual contacts are photolithographically defined using a negative acting photoresist in conjunction with a potassium ferricyanide etchant. The processes detailed in this report were used to process 89 thermopiles with an 80% effective yield. 0 DISTRIBUTION OF W»^*

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