Cell Broadband Engine is a microprocessor that has very high processing performance and very high speed I/O to communicate with other devices such as system LSI and memory chips. Design optimization with statistical analysis was carried out.DOE matrix was made with dimension of signal traces and dielectric constant of the insulator in the package substrate. After major factors were detected, random sampling was done to make sure that the distribution of characteristic impedance of signal traces is within the specification. Passive characterization was carried out with test vehicle. Insertion loss and characteristic impedance is dependent on both temperature and water absorption. These environmental factors need to be taken into account when the design rule is determined. After design rule is fixed, circuit simulation for whole signal channel was carried out with considering impedance tolerance in both the package and the printed circuit board.DOE matrix was made and analyzed to determine the major factors on mid-frequency and low-frequency noise in power distribution. Inductance of package substrate and decoupling capacitor are the major effect on the midfrequency noise, and capacitance of on-module and on-PCB affect low frequency noise. The effect of on-chip parameters was also evaluated. Several types of capacitors were characterized to measure their parasitic parameters. 1.. IntroductionCell Broadband Engine is a multi-core microprocessor based on the state-of-the-art architecture. Details of the chip architecture and internal performance are described in otherFrom a packaging standpoint, Cell Broadband Engine is very challenging for both signal and power integrity. Cell Broadband Engine needs to communicate with other system LSIs and memory chips for input and output of processed data. The bandwidth of chip-to-chip and memory interface is quite large compared to other devices. It needs to increase both the I/O frequency and the number of signal pins. [4] Signal density in the package substrate needs to be increased. It will cause more coupling noise, and degrade both timing and voltage margin. Since I/O frequency is so high, noise issue is very critical to assure the operation of high performance microprocessor.Noise issue is also critical for power distribution design. Because of the high performance of Cell Broadband Engine, operating frequency of processing units is also increased. It means that simultaneous switching noise due to current switching in the processor core will be increased. However, operating voltage tends to be lowered to decrease power consumption. Package designers have to manage these two opposed issues.As stated above, the allowable margin to assure the performance is being decreased. For instance, characteristic impedance of high speed signals needs to be tightly controlled to avoid the loss caused by the reflection at the boundary of package and printed circuit board (PCB). Tight control of dimensions of signal trace is required, but too tight control will affect manufacturing yield a...
Technology migration of the Cell Broadband Engine.TM (BE) Microprocessor to 65nm chip technology precipitated a redesign of the original IC packaging [1,2]. While many of the design changes were necessitated by the chip technology migration, other modifications were implemented to enhance the robustness and overall manufacturability of the product. This paper will discuss key aspects of the 65nm chip technology that drove changes to the package design and also describe some of the modifications to enhance the manufacturability of the product. The paper will outline the statistical analysis, modeling, simulation and characterization employed in the electrical and thermal design, specification and tolerancing of the microprocessor package. The paper will be of specific interest to those involved in the costeffective, high performance IC package design and development and will be of general interest to those developing and refining analysis methods employed in overall design and technology trade-offs in advanced packaging. IntroductionTechnology progression in semiconductor materials and processing has been a forgone conclusion in the electronics industry for the past 25 years enabling sweeps in functional design scope and significant performance enhancements and/or cost reductions. Technology migration of existing designs typically involves a combination of design scope changes and performance enhancements; however, in cost sensitive applications, technology migrations can be motivated principally by the potential for cost reduction. These reductions come mainly by shrinking the overall chip area required to accommodate the design. This is done by employing a more advanced CMOS process technology, hence the term 'technology shrink'. As yield learning progresses in the more advanced process technology, the enhanced productivity in terms of number of chips per wafer and the improved capital equipment utilization in manufacturing quickly provides economic justification for a lower price on each chip. More advanced chip technology also requires a lower operating voltage for the on-chip circuits. This reduces the overall power consumption on the die. This reduction in power consumption leads to lower system thermal management costs. Thus the technology migration achieves the principal design objective by lowering both chip-level and system-level costs. In this design environment, most executives and program managers also
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