The isothermal oxidation behaviour of a Ni25Cr model alloy was studied using specimens of different thicknesses at 1000uC in dry and wet N 2 -1%O 2 . The oxidation mechanisms were evaluated using thermogravimetry and SEM/electron backscatter diffraction analyses of oxide scale cross-sections. The oxidation rates decreased with increasing specimen thickness and increasing water vapour additions in the gas. The findings can be explained by considering the effect of H-defects and in-scale stress state on point defect concentrations in the chromia lattice.
The reactive ion etching (RIE) of the binary transition-metal oxides (TMOs) NiO, CuO and CoO, which are expected to be key materials of resistance random access memory (RRAMÔ), was investigated. We found that inductively coupled plasma using CHF 3 -based discharge, which is highly compatible with conventional semiconductor RIE, is effective for the TMOs studied here. Furthermore, device fabrication using Pt/CoO/Pt trilayers is carried out, and a large change in resistance, which is an essential functionality of RRAM, was successfully observed. This should be definite evidence of a successful RIE realized in the present device fabrication.
The isothermal oxidation behaviour of a Ni25Cr model alloy was studied employing the JuSie-methodology, i.e. using specimens of different thickness for each specific test gas composition at 1000°C in dry and wet N2-1%O2 as well as in Ar-7%H2O. The oxidation mechanisms were evaluated using thermo-gravimetry and SEM/EBSD analyses of oxide scale cross sections. The ion beam polished oxide cross-sections were analysed in terms of oxide grain growth and nucleation rates of new oxide at the oxide-gas interface. The findings can be explained by considering the effect of H-defects and in-scale stress state on point defect concentrations in the chromium sub-lattice.
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