A novel series of polytriazole resins were synthesized by using aromatic diazides and N,N,N′,N′-tetrapropargyl-p,p′-diaminodiphenylmethane (TPDDM) as raw materials. The chemical structures of the resins were characterized by Fourier transform infrared spectroscopy (FTIR) and nuclear magnetic resonance. Rheological behavior indicates that the resins can be processed in a low-temperature region, and some of them have good solubilities in common organic solvents. Differential scanning calorimetry and FTIR results demonstrated that the polytriazole resins can be cured at 70°C. The glass transition temperature (T g ) of cured resins increased with the increase in rigidity of diazide units in polymer chains and reaches up to 328°C.

Cu (I)-catalyzed 1,3-dipolar cycloaddition step-growth polymerization was exploited in the synthesis of a novel class of polytriazoleimides. The polymerization with diazides and imide-containing dialkynes was readily carried out under mild conditions. The chemical structures of the resulting novel polyimides were characterized by Fourier transform infrared and nuclear magnetic resonance. These polymers exhibited good solubility in common polar organic solvents such as N-methyl-2-pyrrolidinone, N,N-dimethylacetamide, dimethylformide and dimethylsulfoxide. The flexible polytriazoleimide films were easily prepared from homogeneous polyimide solutions. The films had good mechanical properties with tensile strengths of 76.2-92.4 MPa as well as elongations at breakage of 4.8-6.9%. The resulting polytriazoleimide films showed a glass transition temperature of 221-254 1C and a decomposition temperature (at 5% weight loss) of 365-377 1C in nitrogen.

Crosslinked structures of a resin had a great influence on its properties. Studying the effect of a crosslinked network on resin properties will benefit to design and prepare a new resin with good performances. A series of alkyne group-capped oligomers were designed and well characterized. The corresponding crosslinked polytriazoles with different network grids were obtained when multifunctional azide monomer was used as a crosslinking agent. The glass transition temperature (T g ) of the crosslinked polytriazoles was measured by Differential Scanning Calorimetry. The results showed networks with a small grid size would exihibit high T g s. The relationship between T g and the size of the network grids of the crosslinked polytriazoles was discussed.

A new kind of 1,2,3‐triazole‐containing aromatic diamines were synthesized by the Cu(I)‐catalyzed 1,3‐dipolar cycloaddition reaction. These diamines were employed to synthesize a series of novel polytriazoleimides (PTAIs) by polycondensation with various aromatic dianhydrides in N,N‐dimethylacetamide (DMAc) via the conventional two‐step method. The obtained polyimides were characterized by Fourier transform infrared, hydrogen‐1 nuclear magnetic resonance, X‐ray diffraction, differential scanning calorimetry, and thermogravimetric analysis techniques. The results show that the PTAIs are soluble in most of strong polar solvents and have inherent viscosity values of 0.47–0.68 dl/g (DMAc). PTAI films have tensile strengths of 60.6–102.6 MPa and elongations at breakage of 3.0–4.1%, glass transition temperatures (Tg) of 208–262°C, and decomposition temperatures (at 5% weight loss) of 368–401°C in N2 atmosphere, which depend on the structure of the polymers. The PTAIs also exhibit good adhesion to copper and gas separation properties. Copyright © 2011 John Wiley & Sons, Ltd.

Crosslinkable polytriazole resins (CPTs) were synthesized by 1,3-dipolar cycloaddition reaction between azide and alkyne monomers. Adhesion properties of CPTs and an epoxy resin to different metal substrates (copper, iron and aluminium) were evaluated in terms of the tensile lap shear strength. CPTs to aluminium and iron substrates have higher adhesion strength than those to copper substrates. The effect of temperature and humidity on adhesion strength has been investigated. The resin CPT-3 has the best heat resistance among CPTs, whose retentions of adhesion strength are approximate 80% at 150°C and 70% at 180°C to all the substrates. CPTs have high adhesion properties at high temperature and humidity as compared with an epoxy resin.