Recent advances in the science and technology of composites utilizing carbon nanostructures are reviewed, including experimental results and modelling studies of composite properties and processing. Carbon nanotubes are emphasized, with other carbon nanostructures such as fullerenes, ultradispersed diamond clusters and diamond nanorods also being discussed.

A novel polytriazole resin prepared from pxylylene diazide (XDA) and N,N,N 0 ,N 0 -tetrapropargyl-p,p 0 -diaminodiphenylmethane (TPDDM) was synthesized and characterized. The resin is soluble in common solvents like acetone. The results show that the polytriazole resin can be cured at 708C. The glass transition temperature and thermal decomposition temperature of the cured resin are 218 and 3508C, respectively. The tensile and flexural strengths of the cured resin achieve 99.0 and 200 MPa, respectively.It is potential as a low cost and easy processing thermal resistant polymer matrix for advanced composite applications.

A novel low-temperature curing polytriazole resin was prepared from a triazide and a tetraalkyne and characterized. The resin can be cured at 70-C. The glass transition temperature T g and thermal decomposition temperature T d5 of the cured resin with the molar ratio of azide to alkyne group [A]/ [B] ¼ 1.0:1.0 reached 324 and 355-C, respectively. The study on the curing kinetics of the resin shows that the apparent activation energy of the curing reaction is 93 kJ mol S1 . The flexural strength of the cured resin reached 137.6 MPa at room temperature and 102.6 MPa at 185-C.Low temperature curing polytriazole resin 557 1608C/2hr, 1808C/2hr, and 2008C/2hr, the DSC curve of the cured A 3 B 4 resin is shown in Fig. 4. As shown in Fig. 4, there was no thermal effect in the whole scanning. This indicates that the curing reaction of A 3 B 4 resin has been completed. Thermal properties of the cured A 3 B 4 resinDMA of the cured A 3 B 4 resin was performed under nitrogen atmosphere. The result is shown in Fig. 5. The glass transition temperature of the cured A 3 B 4 resin reaches 3248C. Thermo-gravimetric curves of the cured A 3 B 4 resin under Scheme 1. Schematic polymerization of A 3 and B 4 .

To explore the function of small heat shock protein genes ( shsp s) and hsp70 in Ericerus pela , we cloned the full-length cDNA sequences of hsp21.5 , hsp21.7 , hsp70 , and hsc70 and the genomic sequence of hsc70 . Open reading frames of the four hsp s were 570, 564, 1,908, and 1,962 base pairs (bp), respectively, which encode proteins with calculated molecular mass of 21.5, 21.7, 69.8, and 71.6 kDa. Amino acid sequence analysis revealed the presence of the conserved Hsp motifs in all four proteins. The genomic DNA of hsc70 had four introns. ep-hsp21.5 was orthologous and ep-hsp21.7 was species specific. Expression of all four transcripts during heat or cold stress and development was examined by quantitative real-time polymerase chain reaction. All four hsp s were upregulated during heat or cold stress in female adults, indicating a correlation between the four hsp s and heat or cold-stress tolerance in female adults. ep-hsp21.7 and ep-hsp70 were upregulated during heat stress in male larvae, implying a correlation between the two hsp s and heat-stress tolerance in male larvae. The four ep-hsp s were also upregulated during the developmental process in males, and ep-hsp21.5 , ep-hsp70 , and ep-hsc70 were upregulated in females, which indicates their possible role in the developmental regulation of E. pela .