The synthesis of homoleptic aryl derivatives of group 11 metals has been performed by reacting the monochlorides [CuCl], [AgCl], and [AuCOCl] with MesMgBr (Mes = 2,4,6-Me3C6H2). The resulting products [Cu6Mes5] (1), [Ag4Mes4] (2), and [Au6Mes5]-2THF (3) have been isolated as crystalline thermally stable compounds. They have, in the solid state, cyclic structures whose molecular geometries are discussed within. MW determination by cryoscopy in benzene and NMR spectra in both C6D6 and C6D12 showed that the three oligomeric structures were in equilibrium with the respective dimeric form of the molecule. In each case the dimeric form was the prevailing species in solution. The solution equilibrium was very rapidly established for the silver and gold complexes and was relatively slower for the copper complex. In the case of the copper complex the rate of equilibrium was solvent dependent, being much faster in toluene (tX/2 for CugMesg being ca. 0.66 h) than in cyclohexane (t1/2 being ca. 56 h). The addition of electron-rich arenes to cyclohexane solutions of 1 greatly enhanced the rate of conversion of the pentamer to dimer.

No abstract

Ion pair complexes, [M(tmtaa)Na(thf)3] (M = Fe, Co, or Ni; tmtaa = dibenzotetramethyltetra-aza[l4]annulene dianion; thf = tetrahydrofuran), in which both metal ions are associated with the macrocyclic ligand have been obtained from single-electron reduction of the parent metal(ii) compounds with sodium metal; the crystal structure of one of the complexes is reported.

Ink jet is an accepted technology for dispensing small volumes of material (50 - 500 picolitres). Currently traditional metal-filled conductive adhesives cannot be processed by ink jetting (owing to their relatively high viscosity and the size of filler material particles). Smallest droplet size achievable by traditional dispensing techniques is in the range of 150 m, yielding proportionally larger adhesive dots on the substrate. Electrically conductive inks are available on the market with metal particles (gold or silver) < 20 nm suspended in a solvent at 30-50 wt%. After deposition, the solvent is eliminated and electrical conductivity is enabled by a high metal ratio in the residue. Some applications include a sintering step. These nano-filled inks do not offer an adhesive function. Work reported here presents materials with both functions, adhesive and conductive. This newly developed silver filled adhesive has been applied successfully by piezo-ink jet and opens a new dimension in electrically conductive adhesives technology. The present work demonstrates feasibility of an inkjettable, isotropically conductive adhesive in the form of a silver loaded resin with a 2-step curing mechanism: In the first step, the adhesive is dispensed (jetted) and procured leaving a "dry" surface. The second step consists of assembly (wetting of the 2nd part) and final curing

Durch Alkoholyse bzw. stufenweise Alkoholyse von Tetrabenzyl‐ bzw. Tetracyclohexyltitan wurden die Titelverbindungen (I)‐(V) dargestellt.