The extraordinary optical and electronic properties of graphene make it a promising component of high-performance photodetectors. However, in typical graphene-based photodetectors demonstrated to date, the photoresponse only comes from specific locations near graphene over an area much smaller than the device size. For many optoelectronic device applications, it is desirable to obtain the photoresponse and positional sensitivity over a much larger area. Here, we report the spatial dependence of the photoresponse in backgated graphene field-effect transistors (GFET) on silicon carbide (SiC) substrates by scanning a focused laser beam across the GFET. The GFET shows a nonlocal photoresponse even when the SiC substrate is illuminated at distances greater than 500 µm from the graphene. The photoresponsivity and photocurrent can be varied by more than one order of magnitude depending on the illumination position. Our observations are explained with a numerical model based on charge transport of photoexcited carriers in the substrate.

Graphene field effect transistors (GFETs) fabricated by chemical vapor deposition graphene deposited onto SiC substrates exhibit sensitivity to broadband visible light. The hysteretic nature of this GFET type was studied utilizing a new current-voltage measurement technique in conjunction with current-time measurements. This measurement method accounts for hysteretic changes in graphene response and enables transfer measurements that can be attributed to fixed gate voltages. Graphene hysteresis is shown to be consistent with electrochemical p-type doping, and current-time measurements clearly resolve a hole to electron to hole carrier transition in graphene with a single large change in gate voltage. V

Device architectures that incorporate graphene to realize detection of electromagnetic radiation typically utilize the direct absorbance of radiation by graphene. This limits their effective area to the size of the graphene and their applicability to lower-energy, less penetrating forms of radiation. In contrast, graphene-based transistor architectures that utilize the field effect as the detection mechanism can be sensitive to interactions of radiation not only with graphene but also with the surrounding substrate. Here, we report the study of the position sensitivity and response of a graphene-based field effect transistor (GFET) to penetrating, well-collimated radiation (micro-beam X-rays), producing ionization in the substrate primarily away from graphene. It is found that responsivity and response speed are strongly dependent on the X-ray beam distance from graphene and the gate voltage applied to the GFET. To develop an understanding of the spatially dependent response, a model is developed that incorporates the volumetric charge generation, transport, and recombination. The model is in good agreement with the observed spatial response characteristics of the GFET and predicts a greater response potential of the GFET to radiation interacting near its surface. The study undertaken provides the necessary insight into the volumetric nature of the GFET response, essential for development of GFET-based detectors for more penetrating forms of ionizing radiation.

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Radiation effects on graphene field effect transistors (GFETs) with hexagonal boron nitride (h-BN) thin film substrates are investigated using 60Co gamma-ray radiation. This study examines the radiation response using many samples with varying h-BN film thicknesses (1.6 and 20 nm thickness) and graphene channel lengths (5 and 10 μm). These samples were exposed to a total ionizing dose of approximately 1 Mrad(Si). I-V measurements were taken at fixed time intervals between irradiations and postirradiation. Dirac point voltage and current are extracted from the I-V measurements, as well as mobility, Dirac voltage hysteresis, and the total number of GFETs that remain properly operational. The results show a decrease in Dirac voltage during irradiation, with a rise of this voltage and permanent drop in Dirac current postirradiation. 1.6 nm h-BN substrate GFETs show an increase in mobility during irradiation, which drops back to preirradiation conditions in postirradiation measurements. Hysteretic changes to the Dirac voltage are the strongest during irradiation for the 20 nm thick h-BN substrate GFETs and after irradiation for the 1.6 nm thick h-BN GFETs. Failure rates were similar for most GFET types during irradiation; however, after irradiation, GFETs with 20 nm h-BN substrates experienced substantially more failures compared to 1.6 nm h-BN substrate GFETs.