The microstructural features of the Si-SiO? system and the chemical physics of its defects are reviewed and examined. Topics are grouped by scientific commonality, rather than by the usual technological manifestations. The role of atomic and molecular sized entities is emphasized, and the latter are limited to those containing only Si, 0, H, or combinations thereof. Most of the reported researches involve x-ray or electron diffraction, Auger or photoelectron spectroscopy, Rutherford backscattering, electron spin resonance, or capacitance-voltage or deep-level transient spectroscopy. Several forms of crystalline and amorphous vitreous silica are considered as a basis for discussion of thin film thermal silica on silicon wafers. Local lattice symmetry, stoichiometry, bond lengths and angles, vacancies and voids, dangling orbital centres, and fixed and migratory hydrogen species are treated extensively. Elements of relevant theory are summarized. Overall, it is hoped to provide a solid data base for future development of general models for essential electronic phenomena in the Si-Si02 system.
Interface states and electron spin resonance centers have been observed and compared in thermally oxidized (111) and (100) silicon wafers subjected to various processing treatments. The ESR Pb signal, previously assigned to interface ⋅Si≡Si3 defects on (111) wafers, was found to have two components on (100): an ⋅Si≡Si3 center oriented in accord with (100) face structure, and an unidentified center consistent with ⋅Si≡Si2O. The quantitative proportionality of Pb spin concentration to midgap interface trap density Dit is maintained on (100), and both are lower by a factor of about 3 compared to (111). This correlation persists over the range of oxidation temperatures 800–1200°C, for both n- and p-doped silicon, cooled by fast pull in oxygen, and cooled or annealed in nitrogen or argon. The correlation is independent of doping level. In samples with different oxide thickness, neither Pb nor Dit varied significantly over the range 100–2000 A, but Pb was smaller at 50 A. In general, ESR is judged to offer promise for further studies of specific interface features.
The band-gap energy distribution of Pb centers on oxidized (100) Si wafers has been determined and compared with interface electrical trap density Dit. Two different Pb centers are observed on (100) Si: Pb0, which has the structure ⋅Si≡Si3, and is essentially identical to the sole Pb center observed on (111) Si; and Pb1, of presently uncertain identity, but clearly different in nature from Pb0. By electric field-controlled electron paramagnetic resonance (EPR) and capacitance-voltage (C-V) measurements, it is found that Pb0 has its (0↔1) electron transition at Ev+0.3 eV and its (1↔2) transition at Ev+0.85 eV. Similarly, Pb1 has its (0↔1) transition at Ev+0.45 eV and its (1↔2) transition at Ev+0.8 eV. The Pb band-gap density correlates qualitatively and quantitatively with the electrical trap density Dit from C-V analysis; nonbonded Pb orbitals are found to be the source of about 50% of the characteristic traps in dry-oxidized, unannealed (100) Si wafers.
Energy distribution of Pb centers (⋅Si≡Si3) and electronic traps (Dit) at the Si/SiO2 interface in metal-oxide-silicon (MOS) structures was examined by electric-field-controlled electron paramagnetic resonance (EPR) and capacitance-voltage (C-V) analysis on the same samples. Chips of (111)-oriented silicon were dry-oxidized for maximum Pb and trap density, and metallized with a large MOS capacitor for EPR and adjacent small dots for C-V measurements. Analysis of C-V data shows two Dit peaks of amplitude 2×1013 eV−1 cm−2 at Ev+0.26 eV and Ev+0.84 eV. The EPR spin density reflects addition or subtraction of an electron from the singly occupied paramagnetic state and shows transitions of amplitude 1.5×1013 eV−1 cm−2 at Ev+0.31 eV and Ev+0.80 eV. This correlation of electrical and EPR responses and their identical chemical and physical behavior are strong evidence that ⋅Si≡Si3 is a major source of interface electronic traps in the 0.15–0.95 eV region of the Si band gap in unpassivated material.
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