Metallo‐organic complexes with nickel as the metal center have been shown to exhibit high electrical conductivities warranting investigation of their thermoelectric potential. A review of metallo‐organic n‐type thermoelectrics is presented with a focus on nickel‐sulfur coordination compounds. Herein, we also investigate the extent of oxidation on thermoelectric properties of poly(Ni‐1,1,2,2‐ethenetetrathiolate) (Ni‐ETT) based materials. Elemental analysis and X‐ray photoelectron spectroscopy are used to characterize samples with different air exposure times, leading to differing levels of oxidation. When blended with an inert polymer matrix, the sample exposed to air for 30 min resulted in an eight times enhancement in electrical conductivity compared to the sample exposed to air for 24 h. Furthermore, the elemental composition of the 30 min sample fit the empirical formula Ax(MC2S4) postulated in literature, while the 24 h sample does not, which we attribute to decomposition during the oxidation process and presence of disulfides. The Seebeck coefficient remains largely unchanged as a function of oxidation time, indicating that this may be a viable technique to decouple Seebeck and electrical conductivity for high‐performance organic thermoelectric materials. © 2016 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017, 134, 44402.

In this study, the electroless deposition of copper and silver was investigated on epoxy and silicon dioxide-based substrates. A cost-efficient, Sn/Ag catalyst was investigated as a replacement for the Sn/Pd catalyst currently used in board technology. The surface of the epoxy based polyhedral oligomeric silsesquioxane (POSS) films was modified by plasma and chemical etching for electroless activation without the creation of a roughened surface. The electroless copper deposited on the modified POSS surface exhibited excellent adhesion when annealed at 180 • C in nitrogen for 90 min or at room temperature for 24 hr. Electroless copper deposition was also demonstrated on oxidized silicon wafers for through silicon via sidewall deposition.

Polymers can be used as temporary place holders in the fabrication of embedded air gaps in a variety of electronic devices. Embedded air cavities can provide the lowest dielectric constant and loss for electrical insulation, mechanical compliance in devices where low-force deformations are desirable, and can temporarily protect movable parts during processing. Several families of polymers have been used as sacrificial, templating polymers including polycarbonates, polynorbornenes (PNBs), and polyaldehydes. The families can be distinguished by chemical structure and decomposition temperature. The decomposition temperature ranges from over 400 °C to below room temperature in the case of low ceiling temperature polymers. Overcoat materials include silicon dioxide, polyimides, epoxy, and bis-benzocyclobutene (BCB). The methods of air-gap fabrication are discussed. Finally, the use of photoactive compounds in the patterning of the sacrificial polymers is reviewed.

Supercritical fluid-based technologies are increasingly being used to develop novel functional nanostructured materials or improve the properties of existing ones. Among these, supercritical deposition (SCD) is an emerging technique to incorporate metals on supports. It has been used to deposit a wide variety of single or multi-metallic morphologies such as highly dispersed species, nanoparticles, nanorods and conformal films on high surface area supports, polymers and crystalline substrates. SCD is also attracting increasing attention for preparation of micro or nano-architectured functional materials in a highly controllable manner for electrochemical energy conversion and storage systems. Increasing number of studies in the literature demonstrates that materials synthesized using SCD are comparable or superior in performance as compared to their conventional counterparts. In this review, an overview of the fundamentals of the SCD technique is presented. Properties of a wide variety of nanostructured functional materials such as supported nanoparticles and films prepared using SCD for electrochemical applications are summarized. The electrochemical performance of these materials in electrochemical tests and also in fuel cells, electrolyzers and Li-ion batteries are also presented.

This study aims at investigating a polymer-based air-gap creation method for the packaging of microelectromechanical systems (MEMS), and exploring the chemical composition of the polymer residue on the final package. Polymer-based air-gap formation utilizes thermal decomposition of a sacrificial polymer, poly(propylene carbonate) (PPC), encapsulated within an overcoat polymer. BCB (Cyclotene 4026-46) was used as the overcoat material because decomposition products of sacrificial polymer are able to permeate through it, leaving an embedded air-gap structure around the MEMS device. Sizecompatibility and cleanliness of MEMS devices are important attributes of the polymerbased air-gap MEMS packaging approach. This study provides a framework for size-compatible and clean air-gap formation by selecting the type of PPC, optimizing thermal treatment steps, identifying air-gap formation options, assessing air-gap formation performance, and analyzing the chemical composition of the residue. The air-gap formation processes using photosensitive PPC films had at least twice the residue compared to processes using nonphotosensitive PPC films. The major contribution to the residue in photosensitive PPC films was from the photoacid generator (PAG), which was used to catalyze the thermal decomposition of the PPC. BCB is compatible with PPC, and provides mechanical stability during creation of the air-gaps. The polymer-based air-gaps provide a monolithic, low-cost, integrated circuit compatible MEMS packaging option.