The fracture behaviour of single crystal silicon (SCSi) microstructures is analysed based on micromechanical torsional and tensile experiments. The uniaxial testpieces are characterised by the presence of sharp notches at the gauge length extremities. The critical loading conditions are reproduced in a finite element model in order to identify the analogies of the failure conditions in tension and torsion. The stress field in the vicinity of the notch tip (were cracks originate) is analyzed, and fracture mechanics parameters are determined. In the finite element model a crack, reproducing the failure process observed in the experiments, is included. The crack area is incrementally increased and the energy release rate for the critical loading conditions in tension and torsion is calculated. Based on these results a failure criterion is formulated along with a procedure for the mechanical integrity analysis of SCSi microstructures of arbitrary shape and loading conditions.

The fracture behaviour of single crystal silicon (SCSi) microstructures is analysed based on micromechanical torsional and tensile experiments. The uniaxial testpieces are characterised by the presence of sharp notches at the gauge length extremities. The critical loading conditions are reproduced in a finite element model in order to identify the analogies of the failure conditions in tension and torsion. The stress field in the vicinity of the notch tip (were cracks originate) is analyzed, and fracture mechanics parameters are determined. In the finite element model a crack, reproducing the failure process observed in the experiments, is included. The crack area is incrementally increased and the energy release rate for the critical loading conditions in tension and torsion is calculated. Based on these results a failure criterion is formulated along with a procedure for the mechanical integrity analysis of SCSi microstructures of arbitrary shape and loading conditions.