Fracture behaviour of single crystal silicon microstructures

Meroni, F.F.; Mazza, Edoardo

doi:10.1007/s00542-004-0444-x

Cited by 8 publications

(4 citation statements)

References 23 publications

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“…Meroni and Mazza later used the same test method to again investigate the torsional mechanical properties of SCS components, but this time analyzed the data using FEA simulations and a fracture mechanics approach. 189 …”

Section: E Torsional Test Methodsmentioning

confidence: 97%

Fracture strength of micro- and nano-scale silicon components

DelRio

Cook

Boyce

2015

Applied Physics Reviews

105

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Silicon devices are ubiquitous in many micro- and nano-scale technological applications, most notably microelectronics and microelectromechanical systems (MEMS). Despite their widespread usage, however, issues related to uncertain mechanical reliability remain a major factor inhibiting the further advancement of device commercialization. In particular, reliability issues related to the fracture of MEMS components have become increasingly important given continued reductions in critical feature sizes coupled with recent escalations in both MEMS device actuation forces and harsh usage conditions. In this review, the fracture strength of micro- and nano-scale silicon components in the context of MEMS is considered. An overview of the crystal structure and elastic and fracture properties of both single-crystal silicon (SCS) and polycrystalline silicon (polysilicon) is presented. Experimental methods for the deposition of SCS and polysilicon films, fabrication of fracture-strength test components, and analysis of strength data are also summarized. SCS and polysilicon fracture strength results as a function of processing conditions, component size and geometry, and test temperature, environment, and loading rate are then surveyed and analyzed to form overarching processing-structure-property-performance relationships. Future studies are suggested to advance our current view of these relationships and their impacts on the manufacturing yield, device performance, and operational reliability of micro- and nano-scale silicon devices.

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Section: E Torsional Test Methodsmentioning

confidence: 97%

Fracture strength of micro- and nano-scale silicon components

DelRio

Cook

Boyce

2015

Applied Physics Reviews

105

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“…The propensity of single crystal silicon to preferential cleavage planes is well known. Since the {111} crystal plane family has the lowest value of surface energy per unit area, when strength loading isn't along{111} plane，the crack front experiences a stress state, which forces the crack to kink, seeking the easiest possible breakage path, slipping to the {111}plane family at last [4]. Silicon crack can be generally separated into two categories: Horizontal die cracking and Vertical die cracking (Fig.…”

Section: The Influence Of Wafer Processingmentioning

confidence: 99%

“…Inevitably, the issue of high stresses induced in the die due to assembly processes and reliability tests starts to elevate. Die crack brought by some assembly process has always been a concern in the semiconductor manufacturing [1][2][3][4][5]. Due to its brittle nature, moderate stresses could result in detrimental fracture in the die.…”

Section: Introductionmentioning

confidence: 99%

Failure Analysis of Cracked Die

Ma¹,

Bao²

2010

ECS Trans.

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Aimed at crack die problem of micro-package, a series of experiments on failure components were conducted by using optical microscope, scanning electron microscope (SEM), Fein focus X-ray, cross section and various chemical etched methods. The failure analysis technique of cracked die in microelement was presented in detail, and the cause of these failure components was found finally. Wafer processing defect on the die has proven to be a contributing factor in the cracking of die. Mechanical damage acted as a stress riser from which the die crack may propagate. The root cause of die cracking in this failure was a consequence of the force inequality which came from mechanical loads in the package.

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“…The finite element method (FEM) has been widely employed to simulate the static and dynamic behavior of microstructures (Meroni and Mazza 2004;Edler et al 2004;Huber and Aktaa 2003;Liu et al 2003;Han and Kwak 2001). Applying FEM to analyze a microstructure requires the geometrical and material properties of the structure as input parameters.…”

Section: Introductionmentioning

confidence: 99%

Identification of material and geometrical parameters for microstructures by dynamic finite element model updating

Chen¹,

Gau

2006

Microsyst Technol

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This paper describes a procedure to identify material and geometrical parameters for microstructures using the concept of finite element model updating. This scheme utilizes measured and finite element analysis (FEA) natural frequencies that are paired together according to their mode shapes, and it incorporates an optimization sequence that formulates the frequency differences as an error vector to be minimized. To demonstrate the effectiveness of the proposed procedure, two examples are shown in this paper. One example involves a microcantilever fabricated from a singlecrystalline silicon wafer, and the updating process is applied on the cantilever to identify its Young's modulus. The identified Young's modulus (along <100> direction) of 130.29 GPa is very comparable to those in the literature. The other example concerns a commercial, V-shaped silicon nitride probe used in an atomic force microscope. The natural frequencies and mode shapes of the probe are measured, the FEA performed, and the probe thickness and the Young's modulus of the silicon nitride substrate determined. The identified thickness is also verified by SEM images of the probe. Both examples show that the updating procedure converged in just a few iterations.

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Fracture behaviour of single crystal silicon microstructures

Cited by 8 publications

References 23 publications

Fracture strength of micro- and nano-scale silicon components

Fracture strength of micro- and nano-scale silicon components

Failure Analysis of Cracked Die

Identification of material and geometrical parameters for microstructures by dynamic finite element model updating

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