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InP / Si substrates were fabricated through wafer bonding and helium-induced exfoliation of InP, and InGaAs solar cells lattice matched to bulk InP were grown on these substrates using metal-organic chemical-vapor deposition. The photovoltaic characteristics of the InGaAs cells fabricated on the wafer-bonded InP / Si substrates were comparable to those synthesized on commercially available epiready InP substrates, thus providing a demonstration of wafer-bonded InP / Si substrates as an alternative to bulk InP substrates for solar cell applications.

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The details of MOCVD growth of lattice-matched (0.74 eV) and lattice-mismatched (0.55 eV and 0.6 eV) InGaAs-based thermophotovoltaic (TPV) devices on InP substrates are discussed. The optimization of growth conditions, structural parameters and run-to-run consistency have played a key role in the development of high quality TPV devices, particularly in the development of lattice-mismatched materials.

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