No abstract

The electrical, optical, and structural properties of light emitting diodes (LEDs) fabricated from the III–V nitride material system have been studied. LEDs with external quantum efficiencies as high as 4% were characterized by transmission electron microscopy and found to contain dislocation densities in excess of 2×1010 cm−2. A comparison to other III–V arsenide and phosphide LEDs shows that minority carries in GaN-based LEDs are remarkably insensitive to the presence of structural defects. Dislocations do not act as efficient nonradiative recombination sites in nitride materials. It is hypothesized that the benign character of dislocations arises from the ionic nature of bonding in the III–V nitrides.

A direct correlation has been established between stacking faults in a-plane GaN epilayers and luminescence peaks in the 3.29–3.41 eV range. The structural features of the stacking faults were determined by diffraction-contrast transmission electron microscopy, while the optical emission characteristics were observed by highly spatially resolved monochromatic cathodoluminescence. The studies were performed in the exact same regions of thinned foils. We find that stacking faults on the basal plane are responsible for the strong emission at ∼3.14eV. Luminescence peaks at ∼3.33 and ∼3.29eV are associated with the presence of stacking faults on prismatic a planes and partial dislocations at the stacking fault boundaries, respectively.

The ability to control structural dimensions below 5 nm is essential for a systematic study of the optical and electrical properties of Si nanostructures. A combination of electron beam lithography, NF3 reactive ion etching, and dry thermal oxidation has been successfully implemented to yield 2-nm-wide Si nanowires with aspect ratio of more than 100 to 1. With a sideview transmission electron microscopy technique, the oxidation progression of Si nanowires was characterized over a range of temperature from 800 to 1200 °C. A previously reported self-limiting oxidation phenomenon was found to occur only for oxidation temperatures below 950 °C. A preliminary model suggests that increase in the activation energy of oxidant diffusivity in a highly stressed oxide may be the main mechanism for slowing down the oxidation rate in the self-limiting regime.

No abstract