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Crystalline Si (c-Si) technology is dominating the photovoltaics market. These modules are nonetheless still relatively expensive, in particular because of the costly silicon wafers, which require large thickness mostly to ease handling. Thin-film technologies, on the other hand, use much less active material, exhibit a much lower production cost per unit area, but achieve an efficiency still limited on module level, which increases the total system costs. A meet-in-the-middle is possible and is the object of this paper. The development of c-Si thin-foil modules is presented: first, the fabrication of the active material on a glass module and then the processing of the Si foils into solar cells, directly on module level. The activity of IMEC in this area is put into perspective with regard to worldwide research results. It appears that great opportunities are offered to this cell concept, although some challenges still need to be tackled before cost-effective and reliable industrial production can be launched.

In this paper, we present the integration of an absorbing photonic crystal within a monocrystalline silicon thin film photovoltaic stack fabricated without epitaxy. Finite difference time domain optical simulations are performed in order to design one- and two-dimensional photonic crystals to assist crystalline silicon solar cells. The simulations show that the 1D and 2D patterned solar cell stacks would have an increased integrated absorption in the crystalline silicon layer would increase of respectively 38% and 50%, when compared to a similar but unpatterned stack, in the whole wavelength range between 300 nm and 1100 nm. In order to fabricate such patterned stacks, we developed an effective set of processes based on laser holographic lithography, reactive ion etching and inductively coupled plasma etching. Optical measurements performed on the patterned stacks highlight the significant absorption increase achieved in the whole wavelength range of interest, as expected by simulation. Moreover, we show that with this design, the angle of incidence has almost no influence on the absorption for angles as high as around 60°.

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We demonstrate the use of a copper-based metallization scheme for the specific application of thin-film epitaxial silicon wafer equivalent (EpiWE) solar cells with rear chemical vapor deposition emitter and conventional POCl 3 emitter. Thinfilm epitaxial silicon wafer equivalent cells are consisting of high-quality epitaxial active layer of only 30 µm, beneath which a highly reflective porous silicon multilayer stack is embedded. By combining Cu-plating metallization and narrow finger lines with an epitaxial cell architecture including the porous silicon reflector, a J sc exceeding 32 mA/cm 2 was achieved. We report on reproducible cell efficiencies of >16% on >70-cm 2 cells with rear epitaxial chemical vapor deposition emitters and Cu contacts.