IN m ' r m P R E r A T t o N s of the strength of ceramic materials, the size of the fracture-initiating surface flaw is invariably described by a single dimension-depth.A variable factor, @, is then used to account for the flaw shape, and determination of @ requires knowledge of the ratio a / c , wherea and c are the axes of an ellipse which describes the flaw shape. This complexity is not necessary; a, @, and c can be eliminated, and the flaw area, A , used to describe the flaw size.For a flaw much smaller than component dimensions and stresses well below the yield stress, Irwin' gives the following equation for the stress-intensity factor, K I , for the opening mode in plane stress*:where G is the strain energy releaserate, E is Young's modulus, u is applied stress, the angle 0 is as shown in Fig. 1, and Y is a geometrical parameter.'For surface flaws, Y =2.0, and for subsurface flaws, Y 1.8. The integral @ varies only with a/c as follows:Note that ifaic in Eq. (2a) has the same value ascia in Eq. (2b), the expressions under the integrals (i .e. elliptic integrals) are numerically equal, but the values of @ differ as follows:(3) A flaw will extend from that point on its periphery where K i is maximum, and this occurs where the first derivative of K I , dKl/ d8, is zero and the second derivative, d2Kl/d8', is negative. From Eq. (l), the maxima are found at 8 = n / 2 f o r a < c and at 8=0 for u >c. It follows that an elliptical flaw of any a/c ratio will tend to reduce its ellipticity during growth. When a circular shape is achieved, Eq. (1) shows that K I is constant along the periphery.Maximum values of K I are given by:In the case of materials which fracture well below the yield stress, Eqs. (4a), (4h), and (4c) apply with u andKl(,n,,, replaced, respectively, by g f , the fracture stress, andKlp, the critical stress-intensity factor, and the following equations are obtained:Equations (5u) and (5b) show that the smaller dimension of the flaw controls fracture, and not necessarily the depth, a . Equation (5b) can, however, be modified to include a dependence of C T~ on a: U Fig. 1. (A) Semielliptical flaw in plate subjected to uniform tensile stress. In ( B ) , the flaw depth,a, is less than its half-width, c, and in (C), a is greater than c .Equations (5a) and (5c) can now be combined in a general relation:where Z , known as the flaw shape ~arameter,".~ is as follows:The effect of flaw shape, aic, on Z is plotted in Fig. 2 . ' Values of the flaw area, A ( A _ = n u c / 2 ) , were calculated for several a/c ratios, and Z 2 vs a / d A has been plotted in Fig. 3. For practical purposes, the curve in Fig. 3 can be approximated by a straight line, Z 2 = 2 . 8 2 a l f i , which, when substituted into Eq. (6) gives 1.68 Kic (7) uj=-~ The use of Eq. (7) in place of Eq. (6) introduces a maximum error of 5 % in calculating the fracture stress associated with any realistic elliptical flaw including where a =c. For flaws with 0.2>a/c>3, Eqs. ( 6) and (7) differ significantly. Eq. (7) may, however, be quite useful for n...