Nanosheet (NS) and nanowire (NW) FET architectures scaled to a gate length (L G) of 16 nm and below are benchmarked against equivalent FinFETs. The device performance is predicted using a 3D finite element drift-diffusion/Monte Carlo simulation toolbox with integrated 2D Schrödinger equation based quantum corrections. The NS FET is a viable replacement for the FinFET in high performance (HP) applications when scaled down to L G of 16 nm offering a larger on-current (I ON) and slightly better sub-threshold characteristics. Below L G of 16 nm, the NW FET becomes the most promising architecture offering an almost ideal sub-threshold swing, the smallest off-current (I OFF), and the largest I ON /I OFF ratio out of the three architectures. However, the NW FET suffers from early I ON saturation with the increasing gate bias that can be tackled by minimizing interface roughness and/or by optimisation of a doping profile in the device body.

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An in-house-built three-dimensional multi-method semi-classical/classical toolbox has been developed to characterise the performance, scalability, and variability of state-of-the-art semiconductor devices. To demonstrate capabilities of the toolbox, a 10 nm gate length Si gate-all-around field-effect transistor is selected as a benchmark device. The device exhibits an off-current (I OFF) of 0 . 03 μA/μm, and an on-current (I ON) of 1770 μA/μm, with the I ON / I OFF ratio 6 . 63 × 10 4, a value 27 % larger than that of a 10 . 7 nm gate length Si FinFET. The device SS is 71 mV/dec, no far from the ideal limit of 60 mV/dec. The threshold voltage standard deviation due to statistical combination of four sources of variability (line- and gate-edge roughness, metal grain granularity, and random dopants) is 55 . 5 mV, a value noticeably larger than that of the equivalent FinFET (30 mV). Finally, using a fluctuation sensitivity map, we establish which regions of the device are the most sensitive to the line-edge roughness and the metal grain granularity variability effects. The on-current of the device is strongly affected by any line-edge roughness taking place near the source-gate junction or by metal grains localised between the middle of the gate and the proximity of the gate-source junction.