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We have measured electron excitation cross sections out of the 1s 3 and 1s 5 metastable levels of Ar into eight levels of the 3p 5 4p manifold. We use the optical method to determine the cross sections by measuring the radiation of the excited atoms. By optically pumping the 1s 5 metastable atoms with a laser, we separate the contributions that each metastable level makes to our observed signal, and thus we can determine the excitation cross sections out of the individual metastable levels. We also interpret the trends in both magnitude and energy dependence observed for the cross sections.[S0031-9007(98)06582-X]

Hierarchical micro- and nanostructured surfaces have previously been made using a variety of materials and methods, including particle deposition, polymer molding, and the like. These surfaces have attracted a wide variety of interest for applications including reduced specular reflection and superhydrophobic surfaces. To the best of our knowledge, this paper reports the first monolithic, hierarchically structured glass surface that combines micro- and nanoscale surface features to simultaneously generate antiglare (AG), antireflection (AR), and superhydrophobic properties. The AG microstructure mechanically protects the AR nanostructure during wiping and smudging, while the uniform composition of the substrate and the micro- and nanostructured surface enables ion exchange through the surface, so that both the substrate and structured surface can be simultaneously chemically strengthened.

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Over the past several years, the semiconductor industry has seen some tremendous developments in using glass as an interposer substrate. Glass has many properties that make it an ideal substrate for interposer substrates such as: ultra-high resistivity, low dielectric constant, ultra-low electrical loss and adjustable coefficient of thermal expansion (CTE) that allows management of 3D-IC stacks. Regardless of technical performance, any glass based solution must also provide significant cost advantages in substrate material, via formation, and subsequent processing. Cost-Effective SolutionsIn this paper, we will cover how fusion formed glass provides cost-effective solutions for the manufacturing of interposer materials for as-formed 100 µm precision substrate with a pristine surface, without the need for polishing, thus eliminating the manufacturing steps for polishing and thinning. Design ConsiderationsFor effective implementation of glass substrates, processing costs for through-glass-vias (TGV) on ultra-thin glass is also a challenge. This paper will reference data from several different designs to demonstrate the impact of design on Corning's TGV process cost relative to silicon solutions. It will also highlight processing lessons learned in fabricating TGV interposers from bare glass into complete packaged test vehicles and their impact on cost. Via CapabilitiesFurthermore, glasses via formation capabilities have dramatically improved over the past several months. Fully populated wafers with >100,000 through and blind holes (25 µm diameter) are fabricated today with 20µm diameters. We report on the significant enhancements demonstrated on important quality parameters. We will also report on strength parameters measured on TGV wafers and positive implications with respect to product reliability.