Silicon photonics (SiPh) enables compact photonic integrated circuits (PICs), showing superior performance for a wide variety of applications. Various optical functions have been demonstrated on this platform that allows for complex and powerful PICs. Nevertheless, laser source integration technologies are not yet as mature, hampering the further cost reduction of the eventual Si photonic systems-on-chip and impeding the expansion of this platform to a broader range of applications. Here, we discuss a promising technology, micro-transfer-printing (μTP), for the realization of III-V-on-Si PICs. By employing a polydimethylsiloxane elastomeric stamp, the integration of III-V devices can be realized in a massively parallel manner on a wafer without substantial modifications to the SiPh process flow, leading to a significant cost reduction of the resulting III-V-on-Si PICs. This paper summarizes some of the recent developments in the use of μTP technology for realizing the integration of III-V photodiodes and lasers on Si PICs.

Silicon photonics (SiPh) is a disruptive technology in the field of integrated photonics and has experienced rapid development over the past two decades. Various high-performance Si and Ge/Si-based components have been developed on this platform that allow for complex photonic integrated circuits (PICs) with small footprint. These PICs have found use in a wide range of applications. Nevertheless, some non-native functions are still desired, despite the versatility of Si, to improve the overall performance of Si PICs and at the same time cut the cost of the eventual Si photonic system-on-chip. Heterogeneous integration is verified as an effective solution to address this issue, e.g. through die-wafer-bonding and flip-chip. In this paper, we discuss another technology, micro-transfer printing, for the integration of nonnative material films/opto-electronic components on SiPh-based platforms. This technology allows for efficient use of non-native materials and enables the (co-)integration of a wide range of materials/devices on wafer scale in a massively parallel way. In this paper we review some of the recent developments in the integration of non-native optical functions on Si photonic platforms using micro-transfer printing.

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Abstract-In this paper, the power consumption of a white-red-green-blue (WRGB) active-matrix organic light-emitting device (OLED) display and the resulting temperature distribution across the display are analyzed as a function of the applied image and the luminance of the emitted light. It has been shown previously that temperature directly impacts the picture quality of an OLED display. Luminance, spectral radiance, power and temperature measurements are performed on a 55-in WRGB OLED display with a resolution of 1920 1080. A power model is presented that allows calculating the display's power consumption for a given applied image. This involves the dependency of the efficiency of the white OLED on the current density, the wavelength dependent transmission of the color filters and the contribution of each of the subpixels in producing the display's nominal white. The output of the power model is used as input for a basic thermal model that simulates the temperature distribution across the display. The thermal model is based on 3D computational fluid dynamics analysis framework (FloEFD). A good agreement between the simulations and measurements on the sample WRGB OLED display is obtained.