Cu/Ni thin film has been made by electroplating method assisted by magnetic fields. The solution consists of a mixture of NiSO 4 (260 g/L), NiCl 2 (60 g/L) and H 3 BO 3 (40g/L). The magnetic field varied in the range of 0-200 gauss in a direction perpendicular to the electric field. Plating was carried out at a voltage of 1.5 volts, the electrolyte temperature is 60 C during 5 s. The results indicate that the Ni film has been formed on the surface of the Cu plate. Testing of sheet resistivity shows that by coating Ni on Cu substrate the resistivity sheet of Cu/Ni increases. The increase in resistivity is proportional to the magnitude of the magnetic field. Investigation on the Ni morphology shows that the larger the magnetic field the smaller the grain size so that the composition of Ni particles becomes more tightly packed. Whereas, in sensor sensitivity, all samples showed their role as low-temperature sensors. The sensitivity decreases along with the magnitude of the magnetic field given.