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Based on a variety of optimization criteria, recent research has suggested that optical interconnects are a viable alternative to electrical interconnects for board-to-board, chip-to-chip, and on-chip applications. However, the design of modern high-performance computing systems must account for a variety of performance scaling factors that are not included in these analyses. We will give an overview of the performance scaling that has driven current computer design, with a focus on architectural design and the effects of these designs on interconnect implementation. We then discuss the potential of optics at each of these interconnect levels, in the context of extant electrical technology.

Be0 AINThe application of high power density electronic components such as fast microprocessors and power semiconductors is often limited by an inability to maintain the device junctions below their maximum rated operaring temperature. The junction temperature rise is determined by the t h d resistance from junction to the ambient thermal environmeat Two of the largest contributions to this thermal resistance are the die attach interface and the package base. A decrease in these resistances can allow increased component packing density in MCMs, reduction of heat sink volume in tightly packed systems, enable the me of higher performance circuit components, and improve reliabil- ity.The substrare for a multichip module or device package is the primary ihermal link between the junctions and the heat sink. Present high power multichip module and single chip package designs use sub- Besides having exceptional thermal properties, the mechanical properties of this material also make it an attractive candidate as an electronic Component substrate material.

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