Optical proximity communication (OPxC) with reflecting mirrors is presented. Direct optical links are demonstrated for silicon chips with better than -2.5dB coupling loss, excluding surface losses. OPxC is a true broadband solution with little impairment to the signal integrity for high-speed optical transmission. With wavelength division multiplexing (WDM) enabled OPxC, very high bandwidth density I/O, orders of magnitude higher than the traditional electrical I/O, can be achieved for silicon chips.
We present results for VCSEL based links operating PAM-4 signaling using a commercial 0.13microm CMOS technology. We perform a complete link analysis of the Bit Error Rate, Q factor, random and deterministic jitter by measuring waterfall curves versus margins in time and amplitude. We demonstrate that VCSEL based PAM-4 can match or even improve performance over binary signaling under conditions of a bandwidth limited, 100meter multi-mode optical link at 5Gbps. We present the first sensitivity measurements for optical PAM-4 and compare it with binary signaling. Measured benefits are reconciled with information theory predictions.
Based on a variety of optimization criteria, recent research has suggested that optical interconnects are a viable alternative to electrical interconnects for board-to-board, chip-to-chip, and on-chip applications. However, the design of modern high-performance computing systems must account for a variety of performance scaling factors that are not included in these analyses. We will give an overview of the performance scaling that has driven current computer design, with a focus on architectural design and the effects of these designs on interconnect implementation. We then discuss the potential of optics at each of these interconnect levels, in the context of extant electrical technology.
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