DIFFUSION OF COBALT 987of the least squares line. This is shown in Fig. 5. The activation energy for diffusion, Q, obtained from the least squares line is Q --28 _ 6 kcal/mole Another point of interest is that the square root relation Vh~ holds for most systems of interest for this model. For gold thicknesses of 3.3 #m and temperature of 50~ (along with the corresponding diffusion coefficient D ----10 -19) the time corresponding to F = 0.6 is of the order of 104 years. If we use smaller thicknesses where the fraction might be appreciable, other transport mechanisms, e.g., porosity, would prevail and the model proposed here would not be applicable. SummaryWe have considered the diffusion of cobalt out of a gold layer. The theory is discussed first to relate measured quantities to diffusion coefficients. Measurements were taken and the appropriate calculations made to obtain values for the diffusion coefficients at different temperatures. Arrhenius plot extrapolations were then made to obtain rough values for the coefficients at lower temperatures. ABSTRACTA new, multilayer metallization system has been developed for the purpose of fabricating a planar interconnect structure. This system comprises two levels of metal interconnection, and the first-level metal layer is buried in a low temperature CVD A12Os film pyrolytically deposited by Al(i-CsH70)3 at 420~ The metal chosen for both layers is aluminum, and the insulator is phosphosilicate glass. In the metal processing, a self-aligned photolithographic technique is applied in which positive photoresist AZ-1350 plays an important role in forming the first-level A1 layer and the A1203 film. * Electrochemical Society Active Member.

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Ein neues Mehrschichtmetallisierungssystem zur Herstellung planarer untereinander verbundener Strukturen wird entwickelt.

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