Abstract:In this paper the concept of a microspectrometer based on a Linear Variable Optical Filter (LVOF) for operation in the visible spectrum is presented and used in two different designs: the first is for the narrow spectral band between 610 nm and 680 nm, whereas the other is for the wider spectral band between 570 nm and 740 nm. Design considerations, fabrication and measurement results of the LVOF are presented. An iterative signal processing algorithm based on an initial calibration has been implemented to enhance the spectral resolution. Experimental validation is based on the spectrum of a Neon lamp. The results of measurements have been used to analyze the operating limits of the concept and to explain the sources of error in the algorithm. It is shown that the main benefits of a LVOF-based microspectrometer are in case of implementation in a narrowband application. The realized LVOF microspectrometers show a spectral resolution of 2.2 nm in the wideband design and 0.7 nm in the narrowband design. 51-54 (1994). 13. K. Burns, K. B. Adams, and J. Longwell, "Interference measurements in the spectra of neon and natural mercury," J. Opt. Soc. Am. 40(6), 339-344 (1950 ©2011 Optical Society of America

This paper reports on the IC-compatible fabrication of vertically tapered optical layers for use in linear variable optical filters (LVOF). The taper angle is fully defined by a mask design. Only one masked lithography step is required for defining strips in a photoresist with trenches etched therein of a density varying along the length of the strip. In a subsequent reflow, this patterned photoresist is planarized, resulting in a strip with a local thickness defined by the initial layer thickness and the trench density at that position before reflow. Hence a taper can be flexibly programmed by the mask design to be from 0.001• to 0.1 • , which enables the simultaneous fabrication of tapered layers of different taper angles. The 3D pattern of resist structures is subsequently transferred into Si or SiO 2 by appropriate etching. Complete LVOF fabrication involves CMOS-compatible deposition of a lower dielectric mirror using a stack of dielectrics on the wafer, tapered layer formation and deposition of the top dielectric mirror. Design principle, processing and simulation results plus experimental validation of the technique on the profile in the resist and after transfer of the taper into Si and SiO 2 are presented.

Multipath transport protocols utilize multiple network paths (e.g., WiFi and cellular) to achieve improved performance and reliability, compared with their single-path counterparts. The scheduler of a multipath transport protocol determines how to distribute the data packets onto different paths. However, state-of-the-art multipath schedulers face the challenge when dealing with heterogeneous paths with dynamic path characteristics (i.e., packet loss, fluctuation of delay). In this paper, we propose Peekaboo, a novel learning-based multipath scheduler that is aware of the dynamic characteristics of the heterogeneous paths. Peekaboo is able to learn scheduling decisions to adopt over time based on the current path characteristics and dynamicity levels -from both deterministic and stochastic perspectives. We implement Peekaboo in Multipath QUIC (MPQUIC) and compare it with state-of-the-art multipath schedulers for a wide range of dynamic heterogeneous environments, upon both emulated and real networks. Our results show that Peekaboo outperforms the other schedulers by up to 31.2% in emulated networks and up to 36.3% in real network scenarios.

The spectral resolution of a MEMS-based IR microspectrometer critically depends on the thermal cross-talk between adjacent TE elements in the detector array. Thermal isolation between elements is realized by using bulk micromachining directly following CMOS processing. This paper reports on the characterization results of bridge-shaped TE detector elements that are cut out of a membrane. Elements with dimensions of 650 × 36 μm 2 are separated by 10 μm wide gaps in order to minimize the thermal cross-talk by heat conduction through the support structure. The static and dynamic aspects of thermal cross-talk have been evaluated with an emphasis on the effect of the thermal conductivity of air as a function of the package pressure.

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