SYNOPSISPolyimide ( P I ) is an insulating polymer that is finding increased use in the semiconductor industry as an intermetal dielectric, passivation coating, and planarization layer. It has a low dielectric constant (3.5 at audio frequencies) and can be processed at temperatures below 450°C. These features make PI attractive to the integrated circuit industry. One disadvantage of this material is that, like most polymers, it is hygroscopic. Moisture can lead to such reliability problems in integrated circuits as increased insulator conductivity, loss of adhesion, and corrosion. It is important to quantify the moisture uptake in polyimide so that the reliability implications of its use can be fully understood. In this study, the steady-state moisture uptake of the model PI pyromellitic dianhydride-oxydianiline (PMDA-ODA) is reported. The moisture uptake is measured using a Cahn 1000 Microbalance with a 1-pg resolution. The samples are prepared by spin-coating one or more layers of the precursor polyamic acid onto 2-in silicon substrates. The moisture uptake in these polymers is found to be linearly related to ambient relative humidity, and the maximum moisture uptake by weight is 3.2%. The moisture uptake in PI is also shown to be a bulk absorption rather than a surface adsorption phenomenon.

Polyimide is used extensively in a variety of integrated circuit packaging applications. It is a good dielectric material with excellent planarizing capabilities, but like most polymers, it absorbs moisture. This hygroscopic behavior can lead to reliability problems in integrated circuit packages. The effects of variations in process history on moisture uptake are examined using gravimetric measurement techniques. In particular, the effects of cure schedule and exposure to high temperature/high humidity environments (85 °C/85% RH) on steady state moisture uptake are reported. Steady state moisture uptake is shown to be a decreasing function of cure temperature. Samples cured at 250 °C absorb 25% more moisture by weight than do samples cured at 400 °C. Moreover, the steady state moisture uptake in polyimide is greater after the samples have been “aged” in a high temperature and humidity ambient. The bulk and surface chemical composition are also monitored as a function of aging using Fourier transform infrared spectroscopy (FTIR) and electron spectroscopy for chemical analysis (ESCA), respectively. The PI surface chemistry degrades after 700 h in an 85 °C/85% RH environment. The bulk chemical composition appears to be unaffected.

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Electronic packaging has been changing.rapidly to meet the often conflicting demands of higher speed and lower cost. In the multichip module (MCM), an array of semiconductor chips is mounted on a substrate and interconnected via a network of multilevel metal lines with polymer layers used as a dielectric between orthogonal metal signal paths. A potential reliability problem that must be investigated is the absorption of moisture by the dielectric in the MCM package. Moisture absorption may lead to long term problems such as loss of adhesion, corrosion of the metal interconnect and increased insulator conductivity.Bisbenzocyclobutene (BCB) is an insulating polymer that is being used in the MCM package as a dielectric material. In this work, the moisture uptake in BCB is investigated gravimetrically using a Cahn-1000 microbalance with a resolution of I pgram. The BCB films are spincoated onto silicon substrates and cured yielding film thickness ranging from 7 to 20µm. The moisture uptake of the BCB film is monitored in situ and non destructively to reveal the performance of the film as used in an integrated circuit environment. The moisture uptake of the films was monitored at different ambient relative humidity (RIH) values between 20% and 80% at 23°C. The transient behavior of the moisture absorption in BCB films has been characterized. Moisture uptake in BCB films increases as the relative humidity is increased, and reaches a maximum of less than 0.2% by weight at 80% RH. By comparison, this moisture uptake is significantly lower than that of fully cured PMDA-ODA polyimide, which is about 2.5% by weight under similar conditions. The transient data show that the equilibration time for a 22.8 µ.m film is approximately 220 seconds, yielding a diffusion coefficient of about 4.5µm2/s.

Infusion is very important for patients who need additional fluids in the body. Intravenous fluids are injected into the body using needles, through veins. Delayed replacement of IV fluids can pose a very high risk for the patient's condition. One of the risk is that the blood can be sucked back and flow in the IV tube, because there is a difference fluid pressure between the vein and the infusion bag. Therefore, controlling the volume of infusion fluid is very necessary so the infusion bag containing the intravenous fluid must not be used up.To minimize the risk is by replacing the IV bag that must be done in a timely manner. So to find out the amount of infusion fluid volume in the infusion bag it will be designed and realized an instrument that can measure the volume of infusion fluid by weighing the weight of the infusion bag. This tool can stop the flow of IV fluids that flow into veins when the IV fluid will be depleted.The result of this research is that the system will stop the infusion fluid flow by activating the pinch valve by clamping the infusion hose so that the fluid can stop when the infusion fluid volume will run out. Discontinuation of infusion fluid occurs when the remaining infusion fluid volume is 10 mL