A sputtered MoS2 thin film is a candidate for realizing enhancement-mode MoS2 metal–oxide–semiconductor field-effect transistors (MOSFETs). However, there are some sulfur vacancies in the film, which degrade the device performance. In this study, we performed postdeposition sulfurization annealing (PSA) on a sputtered MoS2 thin film in order to complement sulfur vacancies, and we investigated the fundamental properties of the MoS2 film. As a result, a high-quality crystalline 10-layer MoS2 film with an ideal stoichiometric composition was obtained at a relatively low process temperature (500 °C). The MoS2 film had an indirect bandgap of 1.36 eV and a high Hall mobility compared with the as-deposited sputtered MoS2 film.

The fabrication of a high-quality single-layer MoS2 film was achieved at a sufficiently low temperature of 500 °C by the combination of sputtering deposition and post deposition sulfurization annealing. Fabrication only by sputtering produces unintentionally sulfur-deficient nonstoichiometric films with poor crystalline quality in nature, making it difficult to fabricate atomically thin sputtered MoS2 films, especially with a single layer. From the results of the sulfurization annealing, sulfur deficiencies in the film were fully complemented and the crystalline quality, especially in-plane symmetry, was dramatically improved. The quasi-layered structure of the sputtered-MoS2 film led to the success in achieving low-temperature sulfurization annealing. Moreover, the film had large area uniformity, accurate thickness controllability, a direct bandgap of 1.86 eV, and an extremely high visible transmittance of more than 97%. Therefore, we consider that the fabrication technique will contribute to realizing MoS2 display applications such as a low-power-consumption thin-film-transistor liquid crystal display.

Molybdenum disulfide (MoS2), one of the transition-metal dichalcogenides, is a 2-dimensional semiconducting material that has a layered structure. Owing to excellent optical and electronic properties, the ultra-thin MoS2 film is expected to be used for various devices, such as transistors and flexible displays. In this study, we investigated the physical and chemical properties of sputtered-MoS2 film in the sub-10-nm region by Raman spectroscopy and X-ray photoelectron spectroscopy (XPS). As the results of Raman spectroscopy investigations, we observed two Raman modes, E12g and A1g, in the 2-dimensional MoS2 films. As the thickness of the MoS2 film decreased, the peak frequency difference between E12g and A1g modes increased. From the XPS investigations, we confirmed sulfur reductions from the 2-dimensional MoS2 films. Therefore, we considered that the sulfur vacancies in the MoS2 film affected the Raman peak positions. Moreover, we performed the additional sulfurization of sputtered-MoS2 films. From the XPS and Raman investigations, the quality of the sputtered-MoS2 films was improved by the additional sulfurization.

The local vibration modes of N–H related defects in GaAsN are studied using isotopes. When GaAsN is grown through chemical beam epitaxy (CBE) using triethylgallium/tris(dimethylamino)arsenic/monomethylhydrazine gas, there are several local vibration modes (LVMs) in Fourier transform infrared (FTIR) spectra. Signals with stretching mode peaks at 2952, 3098, and 3125 cm−1 are reported, along with new wagging and stretching mode peaks at 960 and 3011 cm−1, which exist only in crystals grown through CBE. When the film is grown using deuterated MMHy as a nitrogen source, new peaks at 2206, 2302, 2318, 2245, and 714 cm−1 appear. This suggests that D related defects are created because of the deuterated MMHy. The ratios of frequencies of these new peaks to those obtained from crystals grown using MMHy are nearly 1.34. This suggests that all defects in GaAsN grown through CBE, which appear as LVMs, are N–H related defects. Especially, those with LVMs at 960 and 3011 cm−1 are new N–H defects only found in GaAsN grown through CBE.

This paper describes stoichiometric Ge2Sb2Te5 (GST) film fabrication by the process based on chemical vapor deposition (CVD). GST films were fabricated by tellurization after GeSb CVD. This two step process enabled to fill high aspect holes. By applying appropriate precursors and process temperature, the surface morphology of the GST film was significantly improved. The moderate tellurization reaction process might contribute GST formation with maintaining the amorphous structure of the CVD GeSb. We believe this technique is useful for phase change memory application.