Taking a Cu55Ni45 alloy as experimental alloy systems, we systematically studied the method of obtaining deep undercooling of alloy melt. Stable deep undercooling of alloy melt was obtained by the combination of molten glass purification and cyclic overheating. Combined with the nucleation and growth mechanism of undercooled melt, the microstructure evolution and grain refinement mechanism of the alloy were systematically studied in a wide undercooling range. The grain refinement solidification structure under large undercooling was analyzed by EBSD technology. Combined with the typical characteristics of recrystallization in metallographic pictures, it was finally confirmed that the grain refinement was caused by recrystallization.

The maximum undercooling that has been achieved for Ni-Cu alloy, by using molten glass purification and cyclic super-heating technology, is 270 K. With the help of high-speed photography, the solidification front images of Ni-Cu alloy at various typical undercooling were obtained. Two grain refinements occurred in the range of 60 K< ΔT < 100 K and ΔT > 170 K, the solidification front became smoother, and the solidification position appeared randomly. With the increase of undercooling, the transition from solute diffusion to thermal diffusion leads to the transition from coarse dendrite to directional fine dendrite. At large undercooling, considerable stress is accumulated and some dislocations exist in the microstructure. However, the proportion of high-angle grain boundaries is as high as 89%, with twin boundaries of 13.6% and most strain-free structures, and the microhardness decreases sharply. This indicates that the accumulated stress at large undercooling causes the plastic strains in the microstructure, and in the later stage of recalescence, part of the plastic strains is dissipated by the system and acts as the driving force to promote the recrystallization of the microstructure.

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The solidification microstructure evolution of Ni-25 at.% Cu alloys under different undercooling degrees were studied by the cladding method and cyclic superheating method. Two grain refinement phenomena were observed in the obtained undercooling. In the low undercooling condition, dendrite remelting is the main reason for grain refinement in the recalescence process, while in the high undercooling condition, the stress accumulated in the recalescence process leads to recrystallization in the later stage of recalescence. Under the condition of high undercooling, the solidification structure is composed of complete equiaxed grains with relatively uniform grain size, which indicates that grain boundary migration occurs during grain growth.