A series of highly soluble maleimide-based polymers with photoreactive pendant group were synthesized and used as a gate dielectric insulator for organic thin film transistors. Photoalignment properties were characterized by UV-visible spectroscopy and the alignment of liquid crystals. Photopolymerization of polymer-coated organic thin film transistors with linearly polarized UV light induces anisotropy in field-effect mobility. The gate dielectric insulator based on the photoalignable maleimide shows higher field-effect mobility and on/off current ratio than those from a SiO 2 gate dielectric insulator with the values of 0.3 cm 2 V 21 s 21 and 10 4 , respectively. Our results demonstrate that the photo-induced anisotropy of alignment films to control the molecular order of semiconducting pentacene is a promising technology for improving the performance of organic thin film transistors.
Thermal and Photochemical Reactions of Benzosilacyclobutenes with Alcohols. Intermediacy of o-Silaquinone Methide in the Photochemical Reactions.-The thermal reaction of the easily obtainable benzosilacyclobutenes (V) with alcohols (VI) (12 examples) yields, in contrast to an earlier report and contrary to a similar photochemical reaction, a mixture of the silanes (VII) and (VIII). The photolysis of (V) and probably the thermolytic formation of the tolylsilanes (VII) too, proceeds via an o-silaquinone methide intermediate (IX). -(KANG, K.-T.; YOON, U. C.; SEO, H. C.; KIM, K. N.; SONG, H. Y.; LEE, J. C.; Bull. Korean Chem.
ABSTRACT:A new class of photoresist matrix polymers based on vinyl ether-maleic anhydride (VEMA) alternating copolymers was developed for ArF single-layer lithography. These polymers were synthesized by copolymerization of alkyl vinyl ether and maleic anhydride alternating copolymers with acrylate derivatives containing bulky alicyclic acid-labile protecting groups. The resulting polymers showed good control of polymerization and high transmittance. Also, these resists exhibited good adhesion to the substrate, high dry-etching resistance against CF 4 mixture gas (1.02 times the etching rate of deep UV resist), and high selectivity to silicon oxide etching. Using an ArF excimer laser exposure system with 0.6 NA, 120-nm L/S patterns were resolved under conventional illumination.
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