Wearable electronic medical devices measuring continuous biological signals for early disease diagnosis should be small and lightweight for consecutive usability. As a result, there has been an increasing need for new energy supply systems that provide continuous power without any interruption to the operation of the medical devices associated with the use of conventional batteries. In this work, we developed a patch-type self-charging supercapacitor that can measure biological signals with a continuous energy supply without batteries. The glucose oxidase coated on the surface of the microneedle-type glucose sensor encounters glucose in the interstitial fluids of the human body. Electrons created by glucose oxidation operate the self-powered system in which charging begins with the generation of potential differences in supercapacitor electrodes. In an 11 mM glucose solution, the self-powered solid-state supercapacitors (SPSCs) showed a power density of 0.62 mW/cm2, which resulted in self-charging of the supercapacitor. The power density produced by each SPSC with a drop of 11 mM glucose solution was higher than that produced by glucose-based biofuel cells. Consequently, the all-in-one self-powered glucose sensor, with the aid of an Arduino Uno board and appropriate programming, effectively distinguished normal, prediabetic, and diabetic levels from 0.5 mL of solutions absorbed in a laboratory skin model.

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We present a low temperature and solution-based fabrication process for reduced graphene oxide (rGO) electrodes for electric double layer capacitors (EDLCs).

With the evolution of semiconducting industries, thermomechanical failure induced in a multilayered structure with a high aspect ratio during manufacturing and operation has become one of the critical reliability issues. In this work, the effect of thermomechanical stress on the failure of multilayered thin films on Si substrates was studied using analytical calculations and various thermomechanical tests. The residual stress induced during material processing was calculated based on plate bending theory. The calculations enabled the prediction of the weakest region of failure in the thin films. To verify our prediction, additional thermomechanical stress was applied to induce cracking and interfacial delamination by various tests. We assumed that, when accumulated thermomechanical-residual and externally applied mechanical stress becomes larger than a critical value the thin-film cracking or interfacial delamination will occur. The test results agreed well with the prediction based on the analytical calculation in that the film with maximum tensile residual stress is the most vulnerable to failure. These results will provide useful analytical and experimental prediction tools for the failure of multilayered thin films in the device design stage.

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