In this paper, current conduction mechanisms of an atomic-layer-deposited HfO2 gate stacked on different thicknesses of thermally nitrided SiO2 based on n-type 4H SiC have been investigated and analyzed. Current-voltage and high-frequency capacitance-voltage measurements conducted at various temperatures (25−140 °C) were performed in metal-oxide-semiconductor test structures with 13 nm thick HfO2 stacked on 0-, 2-, 4-, or 6 nm thick nitrided SiO2. Various conduction mechanisms, such as Schottky emission, Fowler-Nordheim tunneling, Poole-Frenkel emission, and space-charge-limited conduction, have been systematically evaluated. The mechanisms of the current conducted through the oxides were affected by the thickness of the nitrided oxide and the electric field applied. Finally, current conduction mechanisms that contributed to hard and soft dielectric breakdown have been proposed.

Bonding characteristics of low-dielectric-constant (low-k) fluorine-incorporated silicon oxide (SiOF) and carbon-incorporated silicon oxide (SiOC) films prepared by plasma enhanced chemical vapor deposition were investigated by Fourier transform infrared spectroscopy (FTIR). The frequency of Si–O stretching vibration mode in SiOF film shifted to higher wave number (blueshift) with the increase of fluorine incorporation, while that in SiOC film shifted to lower wave number (redshift) as the carbon content increased. In N2-annealed SiOC film, the Si–O stretching frequency slightly shifted to lower wave number. To elucidate these phenomena, we have developed the “bonding structure model” based on the electronegativity of an atom. The frequency shifts observed in the FTIR spectra of SiOF and SiOC films were well explained by this model.

Highly improved negative bias illumination stress stability was achieved in a Zn-Sn-O field effect transistor after an ozone (O 3 ) treatment. The untreated ZTO FET exhibited a huge negative threshold voltage shift of 4.2 V but the O 3 treated device exhibited superior stability under NBIS conditions: the V th value of the O 3 treated ZTO FET for 600 s showed almost no change (DV th ¼ À0.07 V) under the same NBIS. The improvement in NBIS stability of the O 3 treated ZTO FETs was attributed to the lower oxygen vacancy concentration and retarded desorption of adsorbed oxygen under photon irradiation by the O 3 treatment.

The effects of the annealing temperature on the structural and chemical properties of soluble-processed zinc-tin-oxide (ZTO) films were examined by transmission electron microscopy, atomic force microscopy, high resolution X-ray reflectivity, and X-ray photoelectron spectroscopy. The density and purity of the resulting ZTO channel layer increased with increasing annealing temperature, whereas the oxygen vacancy defect density decreased. As a result, the device performance of soluble ZTO thin film transistors (TFTs) was improved at higher annealing temperature. Although the 300 °C-annealed ZTO TFT showed a marginal field-effect mobility (μFE) and high threshold voltage (Vth) of 0.1 cm(2)/(V s) and 7.3 V, respectively, the 500 °C-annealed device exhibited a reasonably high μFE, low subthreshold gate swing (SS), Vth, and Ion/off of 6.0 cm(2)/(V s), 0.28 V/decade, 0.58 V, and 4.0 × 10(7), respectively. The effects of dark negative bias stress (NBS) and negative bias illumination stress (NBIS) on the degradation of transfer characteristics of ZTO TFTs were also investigated. The instability of Vth values of the ZTO TFTs under NBS and NBIS conditions was suppressed with increasing annealing temperature. To better understand the charge trapping mechanism, the dynamics of Vth shift with NBS and NBIS time for all ZTO TFTs was analyzed on the basis of the stretched exponential relaxation. The negative Vth shift for each transistor was accelerated under NBIS conditions compared to NBS, which resulted in a higher dispersion parameter and smaller relaxation time for NBIS degradation. The relaxation time for NBS and NBIS instability increased with increasing annealing temperature, which is discussed on the basis of the transition mechanism of oxygen vacancy defects.

Thin film transistors (TFTs) with In and Ga-free multicomponent Zn–Sn–Zr–O (ZTZO) channel layers were fabricated using the cosputtering approach. The incorporation of ZrO2 into the Zn–Sn–O (ZTO) films increased the contact resistance, which led to the degradation of the transport properties. In contrast, the threshold voltage shift under negative bias illumination stress (NBIS) was largely improved from −12.5 V (ZTO device) to −4.2 V (ZTZO device). This improvement was attributed to the reduction in the oxygen vacancy defects in the ZTZO film, suggesting that the photoinduced transition from VO to VO2+ was responsible for the NBIS-induced instability.