outstanding performance in facilitating heat dissipation, the high material density and rigidity made them inefficient for weight-saving portable devices, soft electronics, and heat exchangers of various form factors. Polymer/fillers composites are promising heat dissipation materials for thermal management systems. For example, the thermally conductive fillers such as hexagonal boron nitride, [3,4] Cu nanowire, [5,6] Ag nanowire, [6,7] aluminum nitride, [8,9] carbon nanotubes, [10] and graphene [11] can be dispersed in polymer matrix, and the composites showed thermal conductivity of ≈8 W mK −1 . A higher loading amount of the filler improves the higher thermal conductivity, however, the stiffness of the composite also increased simultaneously. [12] To overcome the limitation, liquid metal-based composite has been adopted. Since liquid metal such as eutectic gallium-indium (EGaIn) has a liquid phase at room temperature, infinitely deformable, electrical conductivity, and thermal conductivity, [13][14][15] soft and deformable composite can be achieved by the incorporation of the liquid metal filler. For this reason, the liquid metal has been utilized in not just only heat dissipation application but also flexible electrode, [16][17][18] deformable energy storage, [19,20] and soft dielectric material. [21][22][23][24] Recently, the liquid metal incorporated elastomer has shown the potential for soft materials with good thermal conductivity. For example, Bartlett et al. reported the liquid metal/polydimethylsiloxane (PDMS) composite for the thermally conductive elastomer. [25,26] The elastomer, which was prepared by the shear-mixing method, was composed of commercial PDMS (Ecoflex 00-30) and EGaIn microparticles with ≈10 1 µm. When the composite was stretched, the anisotropic shape deformation of EGaIn microparticles was induced and aligned with a parallel stretching direction. At this condition, the thermal conductivity of stretching direction was enhanced, whereas that of transverse direction of stretching was slightly decreased. Accordingly, the anisotropic heat dissipation performance of the composite was shown depending on the stretching. Although the commercial PDMS (Ecoflex00-30)/EGaIn microparticles composite claims thermal transport without sacrificing elastic properties, several issues are still remaining. For example, formation of electrically conductive path is one of the issues. Typically, as prepared PDMS/EGaIn microparticle composite is The emergence of soft electronics has led to the need for thermal management with deformable material. Recent efforts have focused on incorporating EGaIn microparticles (≈10 1 µm) into elastomer forming a thermal conductive composites. However, the shape deformation and coalescence of EGaIn particles under mechanical stress often lead to parasitic electrical conduction, imposing limitations on its utilization in thermal management. Increasing the loading of EGaIn nanoparticles (>20 vol%) often leads to brittleness of the composite. Herein, a strategy to obtain thermal...

Soft robots need to be resilient to extend their operation under unpredictable environments. While utilizing elastomers that are tough and healable is promising to achieve this, mechanical enhancements often lead to higher stiffness that deteriorates actuation strains. This work introduces liquid metal nanoparticles into carboxyl polyurethane elastomer to sensitize a dielectric elastomer actuator (DEA) with responsiveness to electric fields and NIR light. The nanocomposite can be healed under NIR illumination to retain high toughness (55 MJ m−3) and can be recycled at lower temperatures and shorter durations due to nanoparticle-elastomer interactions that minimize energy barriers. During co-stimulation, photothermal effects modulate the elastomer moduli to lower driving electric fields of DEAs. Bilayer configurations display synergistic actuation under co-stimulation to improve energy densities, and enable a DEA crawler to achieve longer strides. This work paves the way for a generation of soft robots that achieves both resilience and high actuation performance.

In this review, we summarize the recent progress in chemical surface modification and interfacial manipulations of liquid metal particles and discuss the modification method or requirement of liquid metal particles in emerging applications.

In the past decade, remarkable progress has been made in the domain of augmented reality/virtual reality (AR/VR). The need for realistic and immersive augmentation has propelled the development of haptics interfaces‐enabled AR/VR. The haptics interfaces facilitate direct interaction and manipulation with both real and virtual objects, thus augmenting the perception and experiences of the users. The level of augmentation can be significantly improved by thermal stimulation or sensing, which facilitates a higher degree of object identification and discrimination. This review discusses the thermal technology‐enabled augmented reality and summarizes the recent progress in the development of different thermal technology such as thermal haptics including thermo‐resistive heater and Peltier devices, thermal sensors including resistive, pyroelectric, and thermoelectric sensors, which can be utilized to improve the realism of augmentation. The fundamental mechanism, design strategies, and the rational guidelines for the adoption of these technologies in AR/VR is explicitly discussed. The conclusion provides an outlook on the existing challenges and outlines the future roadmap for the realization of next‐generation thermo‐haptics enabled augmented reality.