Effects of alloying in copper selenide Cu2−xSe with electrically active additions M (where M = In, Sb, In + Sb, Zn, Sn, Zr, Si, Er, Dy, Nd, Al, Cd) are studied in the temperature range of 300 to 430 K which includes the superionic transition temperature (Tc = 413 K for Cu1.998Se) by measuring the modulus of rupture σB, the yeild point σ0.2, the fracture stress ϵB, Young's modulus E, and the microhardness Hμ. It is shown that the doping results in an enhancement of σB, σ0.2, and Hμ and the disappearance of superplasticity at T > Tc.

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