A dual-frequency all-in-one Global Navigation Satellite System (GNSS) receiver with a multi-core 32-bit RISC (reduced instruction set computing) application processor was integrated and manufactured as a System-on-Chip (SoC) in a 110 nm CMOS (complementary metal-oxide semiconductor) process. The GNSS RF (radio frequency) front-end with baseband navigation engine is able to receive, simultaneously, Galileo (European Global Satellite Navigation System) E1/E5ab, GPS (US Global Positioning System) L1/L1C/L5, BeiDou (Chinese Navigation Satellite System) B1/B2, GLONASS (GLObal NAvigation Satellite System of Russian Government) L1/L3/L5, QZSS (Quasi-Zenith Satellite System development by the Japanese government) L1/L5 and IRNSS (Indian Regional Navigation Satellite System) L5, as well as all SBAS (Satellite Based Augmentation System) signals. The ability of the GNSS to detect such a broad range of signals allows for high-accuracy positioning. The whole SoC (system-on-chip), which is connected to a small passive antenna, provides precise position, velocity and time or raw GNSS data for hybridization with the IMU (inertial measurement unit) without the need for an external application processor. Additionally, user application can be executed directly in the SoC. It works in the −40 to +105 °C temperature range with a 1.5 V supply. The assembled test-chip takes 100 pins in a QFN (quad-flat no-leads) package and needs only a quartz crystal for the on-chip reference clock driver and optional SAW (surface acoustic wave) filters. The radio performance for both wideband (52 MHz) channels centered at L1/E1 and L5/E5 is NF = 2.3 dB, G = 131 dB, with 121 dBc/Hz of phase noise @ 1 MHz offset from the carrier, consumes 35 mW and occupies a 4.5 mm2 silicon area. The SoC reported in the paper is the first ever dual-frequency single-chip GNSS receiver equipped with a multi-core application microcontroller integrated with embedded flash memory for the user application program.

Growing importance of wireless communication systems forces reduction of power consumption of the designed integrated circuits. The paper focuses on minimization of power consumption in a digitally controlled oscillator (DCO) that can be employed as oscillator in GPS/Galileo receiver. The new hybrid architecture of DCO combines good phase noise performance of a Colpitts oscillator and relaxed startup conditions of a cross-coupled differential pair oscillator. The proposed new DCO generates a quadrature signal in a current reused frequency divider. Such solution allows of the dissipated power to be reduced. The DCO has been implemented in 110 nm CMOS technology. It generates output signal in frequency range from 1.52 GHz to 1.6 GHz and consumes 1.1 mW from 1.5 V supply voltage. The measured phase noise equals −116 dBc/Hz at 1 MHz offset from 1.575 GHz output signal.

The authors wish to make the following erratum to this paper [...]

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The paper presents an Integer-N phase locked loop (PLL) for Bluetooth receiver implemented in CMOS 130 nm technology. The presented phase locked loop consists of an LC quadrature voltage controlled oscillator with capacitor bank, a tri-state phase-frequency detector with charge pump, a third order passive filter and a programmable divider. The PLL has a supply voltage of 1.2 V and dissipates 2.4 mW. The output frequency range of the phase locked loop is from 2.2 GHz to 2.8 GHz and phase noise is equal -124 dBm/Hz at 3 MHz from carrier frequency.