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Using a coupled Monte Carlo technique for solving both electron and phonon Boltzmann transport equations, the transient electrothermal simulation of nanoscale FETs is performed. It is shown that the time constants for the electron and phonon transport are different in order of magnitude, and the self-heating has little impact on digital circuit delay, while it would affect the bias temperature instability because of the long decay time of the created hot spot. The effectiveness of introducing the lightly doped drain structure is also discussed to reduce the hot spot temperature.

A phonon transport simulator using a Monte Carlo method is used to analyze the heat conduction properties in FinFET structure. We compare the simulation results to those obtained from the conventional heat conduction equation based on the Fourier's law, and discuss about the discrepancies attributed to ballistic transport effect. We also analyze the impact of additional heat path through gate contact, and show that it has a less significant but non-negligible contribution which could slightly reduce the hot spot temperature.