This work investigates the performance of RF immunity procedures exploiting semi-rigid coaxial test probes as coupling devices to inject continuous wave (CW) RF power into the outlets of Integrated Circuits (ICs). Two solutions are presented, both offering the advantage with respect to the traditional direct power injection method, to run the test without removing the IC from its actual PCB. The first procedure resorts to near-field coupling to inject the noise into an interconnecting trace. The second procedure requires metallic contact between the probe tip and the injection point (e.g., a via or an IC pin). Specific figures of merit, such as coupling and power efficiency, test repeatability and intrusiveness, sensitivity to setup parameters and lateral spatial resolution, are introduced and used to ascertain the effectiveness of the proposed procedures. To this end, both numerical simulations and measurements were carried out on several PCBs. Feasibility of the proposed immunity procedures is eventually proven by an application example, involving a thermal sensor as device under test. INDEX TERMS Direct power injection, Microstrip line, Near-field probe, Radiated Immunity, Radio Frequency.

This work investigates the performance of electric nearfield probes, either realized by PCBs or semi-rigid coaxial cables, for immunity testing at PCB level. To this end, fullwave simulations and measurements are exploited to thoroughly investigate the performance of the probes in terms of coupling effectiveness, spatial resolution, impact of probe-to-trace gap, and rated power. Advantages and limitations of the two types of probes are eventually discussed.

This work investigates the possibility to develop timedomain immunity tests using electric near-field probes, for flexible customization of broadband input waveforms injected into specific pins of PCBs. For this purpose, a test design methodology is proposed, which is based on circuit modelling of the injection mechanism on the one hand, and on pulse design and equalization on the other hand. Two circuit models are developed. The former employs measurement/simulation data along with port-reduction techniques to model noise injection through near-field probes by means of internal induced sources. Conversely, the latter model only includes passive components, and is derived starting from physical observation of the involved phenomena. Both models are compatible with circuit solvers and can be easily adapted for different traces under test. Since pulse-like noise is usually broadband, suitable stress waveforms are utilized to obtain different noise spectra. Also, in order to precisely control the shape of the waveform reaching the targeted pin, an equalization procedure is employed. These models and techniques can be easily applied to amplification systems originally designed for frequencydomain tests, thus providing a comprehensive solution for the design of broadband immunity tests in the time domain. The feasibility and accuracy of the proposed methodology are proved by full-wave simulations and measurements.

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A novel high-resolution electromagnetic-wave-source visualization system is presented. The system can determine the incidence angle and visualize the wave source by combining a Lüneburg lens with an electromagnetic band gap (EBG) absorber. The Lüneburg lens is used to physically separate the incident waves coming from different directions and to focus them onto the different focal points on the lens surface. Every element of the EBG absorber coincides with a different focal point on the lens surface, so that the intensity and angle information of the incident wave can be obtained based on the absorbed power and position of the corresponding sensor element. The estimated angular resolution is 2.56 degrees and the system sensitivity is-65.6 dBm/m 2 at 2.45 GHz. The results were confirmed by prototype evaluation.