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In this paper, delamination occurred in Plastic Quad Flat Package (PQFP) had been found after mol-process. From the prelirmnary observation, the wafer surface profile is different from the others from atomic force microscopy (AFM) analysis, for example, the pitch and trench of local die surface. Herein a stress simulation was performed to characterize the interaction among the molding compound formula design, molding process and wafer surface topography. The results show that the wafer topography does have a significant impact on in-situ molding process. Aside from simulation, the Fourier Transform Infiared Spectrometry V I R ) was used to characterize the uniformity of top layer passivation. The result showed that the uniformity of deposited passivation was not quite homogeneous as compared to the well-stunk area, of that might cause insufficient adhesion in which contributed by low density of chemical bonding in the interface. Therefore, wafer surface topography and its chemistry do have a significant impact in IC pack-.

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