A Mechanics Model for the Moisture Induced Delamination in Fan-Out Wafer-Level Package

Chiu, Tz-Cheng; Wu, J.C.L.; Liu, Wei-Te; Liu, Changwei; Chen, Dao-Long; Shih, Meng-Kai; Tarng, David

doi:10.1109/ectc32862.2020.00193

Cited by 11 publications

(2 citation statements)

References 14 publications

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“…The RDL is generally composed of polyimide PI, a diffusion-resistant Ti layer, and Cu wiring. Due to the CTE mismatch between PI/Cu and the non-gas-tightness of PI, which can allow H 2 O and O 2 to pass through, the final delamination of the RDL is caused under dynamic service environments [79,80].…”

Section: Addition Of Barrier Layer On Top Of Rdl Stacksmentioning

confidence: 99%

Delamination of Plasticized Devices in Dynamic Service Environments

Tian,

Chen,

Zhang

et al. 2024

Micromachines

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With the continuous development of advanced packaging technology in heterogeneous semiconductor integration, the delamination failure problem in a dynamic service environment has gradually become a key factor limiting the reliability of packaging devices. In this paper, the delamination failure mechanism of polymer-based packaging devices is clarified by summarizing the relevant literature and the latest research solutions are proposed. The results show that, at the microscopic scale, thermal stress and moisture damage are still the two main mechanisms of two-phase interface failure of encapsulation devices. Additionally, the application of emerging technologies such as RDL structure modification and self-healing polymers can significantly improve the thermal stress state of encapsulation devices and enhance their moisture resistance, which can improve the anti-delamination reliability of polymer-based encapsulation devices. In addition, this paper provides theoretical support for subsequent research and optimization of polymer-based packages by summarizing the microscopic failure mechanism of delamination at the two-phase interface and introducing the latest solutions.

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Section: Addition Of Barrier Layer On Top Of Rdl Stacksmentioning

confidence: 99%

Delamination of Plasticized Devices in Dynamic Service Environments

Tian,

Chen,

Zhang

et al. 2024

Micromachines

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“…In plastic IC packaging, most of the materials are epoxy polymer [ 2 , 3 , 4 , 5 , 6 , 7 , 8 , 9 ]. Moisture adsorbed by the epoxy polymer can result in delamination, aging, and popcorn problems under high temperature [ 10 , 11 , 12 , 13 , 14 , 15 , 16 ]. However, the influence of moisture on the thermal-mechanical properties of epoxy polymer is still obscure.…”

Section: Introductionmentioning

confidence: 99%

Molecular Dynamics Investigation of the Thermo-Mechanical Properties of the Moisture Invaded and Cross-Linked Epoxy System

Sheng

Sun

et al. 2021

Polymers

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In spite of a high market share of plastic IC packaging, there are still reliability issues, especially for the effects of moisture. The mechanism between moisture and epoxy polymer is still obscure. A multi-step cross-linking approach was used to mimic the cross-linking process between the DGEBA resin and JEFFAMINE®-D230 agent. Based on the molecular dynamics method, the thermo-mechanical properties and microstructure of epoxy polymer were analyzed. In this paper, the degree of cross-linking ranged from 0% to 85.4% and the moisture concentration ranged from 0 wt.% to 12 wt.%. The hydrogen bonds were investigated in the moisture invaded epoxy polymer. Although most of the hydrogen bonds were related to water molecules, the hydrogen bonds between the inside of epoxy polymer were reduced only a little as the concentration of moisture increased. The diffusion coefficient of the water molecules was found to increase with the increase of moisture concentration. When the moisture concentration was larger than 12 wt.% or smaller than 1.6 wt.%, the diffusion coefficient was less affected by the epoxy polymer. In addition, the free volume and the thermal conductivity of the epoxy polymer were considered. It was found that the moisture could increase the thermal conductivity from 0.24 to 0.31 W/m/K, identifying a coupling relationship between moisture and thermal properties. Finally, the mechanical properties of epoxy polymer were analyzed by uniaxial tensile simulation. The COMPASS and DREIDING force fields were used during the uniaxial tensile simulation. A better result was achieved from the DREIDING force field compared with the experiment. The degree of cross-linking was positively correlated with mechanical properties. For the system with the largest degree of cross-linking of 85.4%, the Young’s modulus was 2.134 ± 0.522 GPa and the yield strength was 0.081 ± 0.01 GPa. There were both plasticizing and anti-plasticizing effects when the water molecules entered the epoxy polymer. Both the Young’s moduli and yield strength varied in a large range from 1.38 to 2.344 GPa and from 0.062 to 0.128 GPa, respectively.

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Fan-Out Wafer/Panel-Level Packaging

Lau

2021

Semiconductor Advanced Packaging

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A Mechanics Model for the Moisture Induced Delamination in Fan-Out Wafer-Level Package

Cited by 11 publications

References 14 publications

Delamination of Plasticized Devices in Dynamic Service Environments

Delamination of Plasticized Devices in Dynamic Service Environments

Molecular Dynamics Investigation of the Thermo-Mechanical Properties of the Moisture Invaded and Cross-Linked Epoxy System

Fan-Out Wafer/Panel-Level Packaging

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