We present results of a comprehensive reliability evaluation of a 2T-2C, 4Mb, Ferroelectric Random Access Memory embedded within a standard 130nm, 5LM Cu CMOS platform. Wear-out free endurance to 5.4x10 13 cycles and data retention equivalent of 10 years at 85°C is demonstrated. The results show that the technology can be used in a wide range of applications including embedded processing.

We report the electrical properties of a full-bit functional 8 Mbit one transitor-one capacitor (1T-1C) embedded ferroelectric random access memory (eFRAM) fabricated within a low-leakage 130 nm 5 lm Cu interconnect complementary metal oxide semiconductor (CMOS) logic process. To increase manufacturability and reliability margins, we have introduced a single-bit substitution methodology that replaces bits at the low-end of the original distribution with redundant elements leading to an increased signal margin. Further, we have fabricated a digital signal processor (DSP) using the eFRAM process flow and have shown that the operating frequency is nearly the same relative to the CMOS baseline. With the development of logiccompatible eFRAM, we have created a technology platform that enables ultra-low-power devices.

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