SU-8 is an essential material for manufacturing micromechanical components with high demands in aspect ratio and toughness in the area of micro-system technologies. For reproducible production of SU-8 components, e.g. polymeric AFM-cantilevers and chip carriers, a characterization sequence for the material in its raw state and in all subsequent processing steps was developed. Included in these tests were differential scanning calorimetry of the unprocessed resist, in situ monitoring of the solid content during soft bake, measurement of the stress behaviour during and after post-exposure bake as well as determination of micro-hardness and Young's modulus at different baking and exposure conditions. The results are promising with respect to definition of a novel procedure for reproducible preparation of micromechanical components from SU-8.

No abstract

The image based displacement analysis called Digital Image Correlation (DIC) can be used as an alternative to classical TMA and other bulk methods to measure CTE-values of electronic packaging materials. By combining the operation of the thermally optimized commercial equipment EQUINOX from the company OMI and the correlation software VEDDAC of CWM GmbH Chemnitz, it was possible to develop a method to acquire anisotropic CTE values of specimens locally and with an accuracy of +/- 0.5*10 -6 /K over the entire value scale

Increasing functionality in vehicles especially with respect to electromobility is demanding a decrease of energy consumption of numerous board systems. Clustering and miniaturization of sensor applications on the one hand are enabling new features and on the other they are minimizing energy needs for their operation. For modern vehicle driving stability or navigation systems e.g., the SCoM (stacked chip on MEMS) approach will provide the technology enabling shrinking of the sensors size on a high integration level by bringing intelligence directly to the sensor. To cope with the reliability requirements, restrictive qualification and zero defect strategies have been established by the automotive industry. Hence, introduction of innovative technologies in automotive applications must be accompanied by the demonstration of their reliability and safety. It is the goal of the RESTLES [1] project to eliminate parasitic sensor effects caused by process tolerances, intrinsic material stress, thermal mismatch, temperature and aging phenomena by transferring dedicated compensation models into the sensor and circuit design. To evaluate influences of thermo-mechanical stresses and strains, extensive simulations of the package behavior and non-destructive evaluation have been performed