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The paper presents the results of extensive studies on circuit board solderability comparing wetting balance and IPC test methods through performance in vapour phase and wave soldering operations. The effects on solderability of key parameters are examined and compared with storage times of one year, and accelerated ageing using damp heat, dry heat and steam oxygen. An evaluation is made of tin‐lead alloys from 40/60 to 70/30 in solder coating thicknesses from 0·1 to 1·0 mil.

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