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The physical effects of glow discharges used for plasma deposition and plasma etching which can lead to contamination, radiation damage or bombardment‐induced surface damage are reviewed. Different effects are observed for reactors with internal and external electrodes. Analyses of the electrical condition of important regions of both reactor types are given along with measured potentials in various systems. It is shown that substrates, internal walls and internal electrodes act as rf sputtering targets, and that the observed potentials are dependent both on reactor geometry and operating conditions. Techniques for minimizing contamination and damage are given.

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