This paper summarizes an alternate test methodology that enables significant reduction in testing time and tester complexity for RF circuits without the need for low-level simulation models. Traditionally, alternate test makes use of circuit and process-level models to analyze the sensitivity of datasheet specifications to the variations in process parameters. In this paper, we demonstrate a "gray-box" approach by creating a high-level simulation model from datasheet information and simple hardware measurements. This model is used together with a customized behavioral simulator to enable efficient search of an alternate test stimulus that is optimal in terms of tester constraints, test time and specification prediction accuracy. The specific example is a third party RF front-end chip, for which 13 specifications including S-parameters, intermodulation products and noise figures are measured with both conventional and alternate methods. The results are compared in terms of testing time, tester cost and accuracy.