The origin of the two-dimensional electron gas (2DEG) in AlGaN/GaN heterostructure field effect transistors is examined theoretically and experimentally. Based on an analysis of the electrostatics, surface states are identified as an important source of electrons. The role of the polarization-induced dipole is also clarified. Experimental Hall data for nominally undoped Al0.34Ga0.66N/GaN structures indicate that ∼1.65 eV surface donors are the actual source of the electrons in the 2DEG, which forms only when the barrier thickness exceeds 35 Å.

The formation of the two-dimensional electron gas (2DEG) in unintentionally doped AlxGa1−xN/GaN (x⩽0.31) heterostructures grown by rf plasma-assisted molecular-beam epitaxy is investigated. Low-temperature electrical-transport measurements revealed that the two-dimensional electron gas density strongly depends on both the thickness of the AlGaN layer and alloy composition. The experimental results agree very well with the theoretical estimates of the polarization-induced 2DEG concentrations. Low-temperature electron mobility was found to be much higher in the structures with lower electron sheet densities. Interface roughness scattering or alloy disorder scattering are proposed to be responsible for this trend. A maximum mobility of 51 700 cm2/V s (T=13 K) was obtained in the Al0.09Ga0.91N/GaN structure with a two-dimensional electron gas density of 2.23×1012 cm−2.

The effect of dislocations on the electrical characteristics of GaN p-n junctions has been examined through current–voltage measurements. Lateral epitaxial overgrowth (LEO) was used to produce areas of low dislocation density in close proximity to areas with the high dislocation density typical for growth on sapphire. A comparison of p-n diodes fabricated in each region reveals that reverse-bias leakage current is reduced by three orders of magnitude on LEO GaN. Temperature-dependent measurements on the LEO diodes indicate that the remaining leakage current in these devices is associated with a deep trap level.

A combination of atomic force microscopy and scanning capacitance microscopy was used to investigate the relationship between the surface morphology and the near-surface electrical properties of GaN films grown on c-axis sapphire substrates by metalorganic chemical vapor deposition. Local regions surrounding the surface termination of threading dislocations displayed a reduced change in capacitance with applied voltage relative to regions that contained no dislocations. Capacitance–voltage characteristics obtained from these regions indicated the presence of negative charge in the vicinity of dislocations.

Solar-blind ultraviolet photodiodes with a band-edge wavelength of 285 nm were fabricated on laterally epitaxially overgrown GaN grown by metalorganic chemical vapor deposition. Current–voltage measurements of the diodes exhibited dark current densities as low as 10 nA/cm2 at −5 V. Spectral response measurements revealed peak responsivities of up to 0.05 A/W. Response times for these diodes were measured to be as low as 4.5 ns for 90%-to-10% fall time. For comparison, diodes were fabricated using the same p–i–n structure deposited on dislocated GaN. These diodes had dark current densities many orders of magnitude higher, as well as a less sharp cutoff, and a significant slow tail under impulse excitation.