Oxide dielectric present in metal oxide semiconductor high electron mobility transistor plays an important role during formation of two dimensional electron gas (2DEG). The sheet charge concentration (n s ) is dependent on the Eigenenergy states present in triangular quantum well at AlGaN/GaN interface. The energy states are in fact functions of vertical electric field at the edge of the well. Therefore in this paper a model is developed to find out Electric field and flat-band voltage (V T ) by adopting energy band approach to incorporate oxide parameters in it unlike the conventional method of solving Poisson's equation, which is the uniqueness of this paper. The Eigenenergy states are dependent non-linearly on electric field. In the present case, three quantum states in the well are considered along with the Fermi-Dirac distribution function to obtain n s . The dependence of 2DEG density, electric field and flat-band voltage on the oxide parameters such as thickness and electrical permittivity is analyzed. With respect to thickness in SiO 2 and Al 2 O 3 , n s shows inverse relationship; whereas in HfO 2 it is direct due to positive charges accumulated at oxide/barrier interface. To the best of author's knowledge the work is first of its kind and due to lack of experimental data; the obtained results are compared with TCAD results to validate the model.

We have developed a physics based analytical model for the calculation of threshold voltage, two dimensional electron gas (2DEG) density and surface potential for AlGaN/GaN metal oxide semiconductor high electron mobility transistors (MOSHEMT). The developed model includes important parameters like polarization charge density at oxide/AlGaN and AlGaN/GaN interfaces, interfacial defect oxide charges and donor charges at the surface of the AlGaN barrier. The effects of two different gate oxides (Al2O3 and HfO2) are compared for the performance evaluation of the proposed MOSHEMT. The MOSHEMTs with Al2O3 dielectric have an advantage of significant increase in 2DEG up to 1.2 × 1013 cm−2 with an increase in oxide thickness up to 10 nm as compared to HfO2 dielectric MOSHEMT. The surface potential for HfO2 based device decreases from 2 to −1.6 eV within 10 nm of oxide thickness whereas for the Al2O3 based device a sharp transition of surface potential occurs from 2.8 to −8.3 eV. The variation in oxide thickness and gate metal work function of the proposed MOSHEMT shifts the threshold voltage from negative to positive realizing the enhanced mode operation. Further to validate the model, the device is simulated in Silvaco Technology Computer Aided Design (TCAD) showing good agreement with the proposed model results. The accuracy of the developed calculations of the proposed model can be used to develop a complete physics based 2DEG sheet charge density and threshold voltage model for GaN MOSHEMT devices for performance analysis.

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